Through hole silver paste: an advanced solution to enhance the reliability of circuit boards

1、 Excellent conductivity and thermal conductivity
Due to its high density requirements, the modern electronic equipment sector has put forward higher demands for the reliability and performance of circuit boards. (取决于上下文，如"but" Through hole silver pasteAs an advanced solution, it has excellent conductivity and thermal conductivity.
1.1 Conductivity
The conductive lines on traditional circuit boards are usually soldered, but the solder joints are susceptible to temperature changes and mechanical stress, resulting in poor stability. The emergence of perforated silver paste solved this problem. Circuit boards printed with through-hole silver paste can form electrical circuits with good conductivity, providing stable and reliable transmission paths for high-frequency signal transmission, ordinary current transmission, and weak signal transmission.
1.2 Thermal conductivity
During the operation of electronic devices, energy consumption and heat generation processes are often accompanied. Good thermal conductivity can effectively dissipate the generated heat quickly, avoiding equipment damage caused by overheating of the circuit board. Through excellent thermal conductivity, the through-hole silver paste forms a film on the circuit board substrate, effectively improving the heat dissipation effect and ensuring the normal operation of the equipment.

2、 Product features and technical parameters
2.1 Product components: Thermosetting single component, with a silver gray appearance.
         Through hole silver pasteAdopting a thermosetting single component form, the key component is conductive silver particles with a silver gray color. This design enables the through-hole silver paste to have good fluidity and printability, making it easy to accurately print and coat on circuit boards.
2.2 Technical Parameters
-Viscosity (25 ℃): 40 ± 5dPa. s
Viscosity is one of the important indicators for measuring fluid fluidity, especially for the printing process. The through hole silver paste has a suitable viscosity, ensuring good control of its fluidity during the manufacturing process.
-Solid content: 75%
High solid content is one of the important factors that lead to good conductivity of through-hole silver paste. The high solid content ensures that the conductive silver particles fully contact and form conductive pathways during the printing process, enhancing the reliability of the circuit board.
-Thixotropy: 3-5
Through hole silver paste has suitable thixotropy, which enables it to form a smooth and delicate conductive film after curing during printing, improving adhesion and reducing resistance.
-Heat resistance: Excellent
In the operation of electronic devices, there will be a high temperature environment accompanying it. Through hole silver paste has good heat resistance and can maintain stable conductive properties in high temperature environments.
-Chemical resistance: excellent
Electronic devices often face corrosion from various chemical substances, such as acids, alkalis, etc. Through hole silver paste has excellent chemical resistance and can maintain stable conductivity in such harsh environments.
-Preservation: Excellent
Through hole silver paste has good preservation properties, and even after long-term storage, its conductivity and flowability will not significantly decrease.
3、 Practical application cases and value
         Through hole silver pasteWidely used, covering fields such as communication, aerospace, electronic devices, etc. Taking the communication industry as an example, the arrival of the 5G era requires high-speed signal transmission on circuit boards to be more stable. By adopting through hole silver paste technology, not only can high-frequency signal transmission be met, but the reliability of the equipment is also improved, making the communication network more stable, reducing signal transmission interruptions and quality issues, and providing users with a better communication experience.
Summary:
As an advanced conductive solution, it has excellent conductivity and thermal conductivity, which can significantly improve the reliability of circuit boards. Its characteristics and technical parameters make it suitable for various electronic device sectors and have achieved significant results in practical applications. In the future, with the continuous development of electronic devices, through-hole silver paste will continue to play its important role and promote the further development of the electric through-hole silver paste sub industry.