Two component thermal conductive adhesive is a type of two-component thermal conductive adhesive composed of two components: curing agent and filler

Two component thermal conductive adhesiveIt is a two-component thermal conductive adhesive composed of two components: curing agent and filler. It is mainly used in electronic products, heat dissipation systems, building materials and other fields, such as battery modules CPU module The connection between GPU modules, etc. Two component thermal conductive adhesives typically have high thermal conductivity and stability, which can effectively improve the reliability and stability of electronic products.

1. Two component thermal conductive adhesive is composed of two components, A and B, where component A is the thermal conductive filler and component B is the curing agent. When in use, simply mix component A with component B and stir.
   

   
   

2. Two component thermal conductive adhesive is composed of a curing agent and a filler, where the curing agent plays a bonding role and the filler plays a thermal conductive role. Mix the two thoroughly before use.
   

   
   

3. Two component thermal conductive adhesives have different viscosities and curing times, with liquids having higher viscosities and shorter curing times; And those with shorter curing time are solids, while those with longer curing time.

1. Formula design: Determine the formula structure based on application requirements and performance requirements, including the ratio of curing agent and filler.
   

   
   

2. Raw material preparation: Add components A and B separately into a stirring container, and then mix them evenly according to the ratio.
   

   
   

3. Mixing: Place the mixture into a mixing container and slowly mix until the mixture reaches a uniform state.
   

   
   

4. Curing molding: Under certain temperature and humidity conditions, the mixture is cured to form a two-component thermal conductive adhesive.
   

   
   

5. Testing and evaluation: Conduct testing and evaluation after curing to ensure that the performance of the thermal conductive adhesive meets the requirements.
   

Two component thermal conductive adhesiveThe market demand mainly comes from the following aspects:

The development of electronic products: As the volume of electronic products becomes smaller and their heat generation increases, the demand for thermal conductive adhesives is also increasing. As a connector between electronic components, it can effectively improve the reliability and stability of electronic products.

Application of heat dissipation system: Thermal conductive adhesive is usually used in heat dissipation systems to reduce the heat accumulation of electronic components and improve their stability.

Other applications: There are also some other applications, such as building materials, medical equipment, etc., that have a certain degree of impact on the demand for thermal conductive adhesive. The market demand is expected to maintain steady growth, and the demand for two-component thermal conductive adhesive will also increase accordingly.