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Multilayer chip ceramic capacitor (mlcc) is a monolithic structure formed by mixing ceramic powder, adhesive (such as polyvinyl butyral pvb), and plasticizer (such as phthalate plasticizers) into a ceramic film, and then printing internal electrodes on the ceramic film and laminating and cutting them in a staggered manner. Poor stacking accuracy and cutting cracking are the two main problems that are prone to occur in existing multilayer ceramic capacitors, which can seriously affect the product's qualification rate and reliability. The stacking accuracy and cutting performance of multilayer ceramic capacitors are greatly affected by the mechanical strength, toughness, and adhesion of the ceramic film, and the physical properties of the ceramic film mainly depend on the mechanical properties of the adhesive resin.
Ceramic film is made by mixing ceramic powder, adhesive, plasticizer, etcdielectric pasteMade by casting. The existing medium slurry formula has the problem of not being able to balance the strength and thermal pressure adhesion of the produced ceramic film sheets, which not only leads to problems such as stacking offset, poor accuracy, and low strength in the prepared blocks, but also causes the ceramic film sheets on the stacked blocks to break and crack.
Therefore, it is urgent to develop a slurry that can produce multi-layer ceramic capacitors with good strength, good adhesion performance, good stacking accuracy, and low cracking ratio.
Polymer conductors andEncapsulation slurryIt is a new product developed by advanced technology institutes, which is environmentally friendly and does not contain harmful substances; Low odor; Can be stored at room temperature, no need to put it in the refrigerator; Long storage period, can be stored at room temperature for 6 months; Acid and alkali resistant, can adapt to environments such as electroplating; Low curing temperature, curing at 180-220 ℃ for 30 minutes, with minimal impact on resistance; Easy to print and resistant to aging, it is an excellent encapsulation material for ceramic thick film resistors, resistors, and ozone sheets.
Serial Number |
name |
model |
Viscosity |
Heat curing temperature and time |
Acid resistant (5% HCl, 30min) |
Film thickness (200~250 mesh stainless steel mesh) |
pressure resistance |
1 |
Blue sealing paste |
DJ012 |
250±50Pa·S |
180~220℃/30min |
excellent |
25±5μm |
≥500V |
2 |
Green encapsulation slurry |
DJ011 |
250±50Pa·S |
180~220℃/30min |
excellent |
25±5μm |
≥500V |
3 |
Black sealing paste |
DJ013 |
250±50Pa·S |
180~220℃/30min |
excellent |
25±5μm |
≥500V |
4 |
Red sealing paste |
DJ014 |
250±50Pa·S |
180~220℃/30min |
excellent |
25±5μm |
≥500V |
5 |
White encapsulation slurry |
DJ010 |
250±50Pa·S |
180~220℃/30min |
excellent |
25±5μm |
≥500V |
6 |
Polymer conductor paste |
DA010 |
250±50Pa·S |
180~220℃/30min |
Square resistance: ≤ 100mΩ |
25±5μm |
Color: Silver White |
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