Low temperature drying type square resistance paste

Low temperature drying type square resistance pasteIt is a type of resistive material mainly used to manufacture coils and resistors in electronic devices. The main component of this resistor slurry is synthetic graphite, which is added with materials such as coal tar pitch and resin with low expansion coefficient, as well as some conductive fillers and thickeners.

The manufacturing process of low-temperature drying type square resistance paste includes steps such as mixing, grinding, and drying. Among them, mixing refers to mixing various components together. Grinding can make the material particles finer, while drying can make the material denser and more uniform.

Compared to traditionalEpoxy resin slurryLow temperature drying type square resistance paste has higher temperature stability and drying performance, can be dried at lower temperatures, and can maintain higher resistance values and stability after drying. In addition, low-temperature drying type square resistance paste also has better chemical stability and oxidation resistance, and can be used in high temperature and high humidity environments without being affected.

Low temperature drying typeSquare resistor pasteWidely used in fields such as electronic devices, motors, electrical appliances, and aerospace, it has high resistance value, stability, and chemical stability, which can meet the requirements of resistors in these fields. Meanwhile, the production cost of this resistor paste is relatively low, making it suitable for use in industrial scale production.

low The characteristics of warm drying type square resistance paste mainly include the following aspects:
Easy packaging: Low temperature drying type square resistance paste does not require special packaging methods. It only needs to lay a layer of copper foil or silver foil on a regular PCB board, and then heat it to a certain temperature to package small resistance components.
Good stability: Low temperature drying type square resistance paste has good stability and can maintain stability in high temperature and high humidity environments without problems such as resistance value changes or detachment.
High reliability: Low temperature drying type square resistance paste has high reliability because its main components are Conductive metal particlesAnd organic carriers are not affected by external factors.
Application field: Low temperature drying type square resistance paste is mainly suitable for packaging small resistance components, such as resistors, capacitors, diodes, etc. This slurry has the advantages of easy operation, easy packaging, and high reliability, and has therefore been widely used in the field of electronic product packaging.
quality assurance Low temperature drying type square resistance pasteUsing professional equipment for packaging ensures the quality and reliability of the product. At the same time, the low-temperature drying type square resistance paste produced by legitimate manufacturers has undergone strict testing and screening, and can be used with confidence.

Precautions for using low-temperature drying type square resistance paste:

1. Control of drying temperature: The level of drying temperature will directly affect the performance of the product. Generally speaking, while ensuring product requirements, the drying temperature can be raised as much as possible to improve pulse efficiency, but the temperature should not be too high to prevent certain substances from undergoing denaturation.

2. Time control: The length of drying time also directly affects the performance of the product. Generally speaking, while ensuring product requirements, the drying time can be shortened as much as possible to improve pulse efficiency, but it cannot be too short to avoid a long production cycle that is not conducive to industrial production.

3. Selection of soldering flux: The choice of soldering flux should be determined based on the material of the solder wire, the packaging form, and the size of the solder pad. In production, matching soldering flux should be selected as much as possible to ensure good soldering effect.

4. Control of panel temperature: The panel temperature also directly affects the performance of the product. Generally speaking, while ensuring product requirements, the board temperature can be raised as much as possible to improve pulse efficiency, but the temperature should not be too high to avoid burning out components.

5. Drying intensity: In production, the optimal value can be explored by changing the drying intensity to achieve the required drying effect of the product.