PI copper-clad heating film has various application fields

PI copper-clad heating filmIt is a functional material composed of polyimide (PI) film and copper foil. As a heating element, it has excellent thermal conductivity and electrical conductivity, as well as good insulation performance.

The preparation process of the heating film generally consists of three main steps. Firstly, the polyimide material is transformed into a thin film by solution or melting method to ensure a smooth surface and certain thickness control. Then, the copper foil is tightly connected to the polyimide film through bonding or layered structure, forming a PI copper-clad composite structure. Finally, the PI copper-clad film is subjected to heating treatment to achieve higher thermal and electrical conductivity.

PI copper-clad heating film has various application fields. Firstly, in the field of electronic products, it can be applied to thin heaters, flexible heating elements, electronic heat sinks, and other applications. Secondly, in the field of medical devices, this heating film can be used to make heating elements in medical equipment, such as temperature control modules, human body warming devices, etc. In addition, PI copper-clad heating film can also be widely used in heating, sensing, and antifreeze functions in aerospace, automotive, military, and other fields.

It should be noted that,PI copper-clad heating filmRelevant safety regulations and operational requirements need to be followed during use. When selecting appropriate power sources and controllers, parameters such as current, voltage, and power of the heating film should be fully considered to ensure the normal operation and safety of the equipment.