Gold conductor paste is a conductive paste with gold as the main functional phase, which has excellent conductivity and printing performance

         Gold conductor pasteIt is a conductive paste with gold as the main functional phase, which has excellent conductivity and printing performance. It has the advantages of high fine line resolution, smooth film surface, low backlight porosity, small film edge shrinkage, and high cross-sectional density. It is widely used in multi-layer wiring conductors, gas sensors, microwave hybrid integrated circuits, high-power transistor chips and lead frames, and other high reliability, high-density thick film integrated circuits.
Gold conductor paste is usually prepared using gold powder, which generally has a spherical or quasi spherical morphology, high tap density, and particle size in the micrometer or submicron range. This morphology and size of gold powder endow the gold conductor paste with excellent performance. Firstly, spherical or quasi spherical gold powder has lower grain boundary energy, which is conducive to the formation of a denser film structure, thereby improving its conductivity. Secondly, the high compaction density of gold powder can improve the film quality of the conductor paste and make the film surface smoother. In addition, high compaction density can also improve the encapsulation performance and oxidation resistance of gold conductor paste.
Gold conductor paste has excellent conductivity, thanks to the excellent conductivity of gold. Gold is one of the most commonly used conductive materials, with a high conductivity of up to 4.1 × 10 ⁷ S/m. This enables the conductive film prepared from gold conductor paste to meet the requirements of low resistance and high conductivity, and can meet the conductivity requirements of modern electronic devices.

In addition to excellent conductivity, gold conductor paste also has outstanding printing performance. Gold conductor paste can maintain good operability during the printing process, form a uniform printing layer, and achieve small backlight porosity and film edge shrinkage during high-temperature sintering, thereby ensuring the stability and reliability of printed circuits. In addition, the printing performance of gold conductor paste is also affected by factors such as its composition ratio, particle size, and dispersibility.
However, the use of gold conductor paste is limited by the high cost of gold. At present, the market price of gold is relatively high, which makes the cost of gold conductor paste relatively high, hindering its promotion in large-scale applications. In order to reduce costs, researchers have developed some gold conductor pastes suitable for specific applications by controlling the morphology and size of gold powder, giving them a competitive advantage in cost.
in summary, Gold conductor pasteDue to its excellent conductivity, high resolution, and outstanding printing performance, it has become an indispensable material in thick film integrated circuits with high reliability and density. Although the use of gold conductor paste is limited by the high price of gold, researching and developing new types of gold conductor paste and exploring low-cost alternative materials can further expand its application fields and promote the development and progress of electronic devices.