Silver palladium conductor pasteIt plays an important role in the preparation of thick film circuits, as it can produce uniform color and has excellent performance indicators. This article will introduce the appearance and performance indicators of silver palladium conductor paste, as well as recommended usage processes, to help readers have a more comprehensive understanding of the product.
Appearance: The silver palladium conductor paste is a paste with uniform color, and its color changes from light to dark gray with increasing palladium content. This uniform appearance makes the silver palladium conductor paste easier to handle during the preparation process and allows for better process control.
Performance indicators of silver palladium paste: The performance indicators of silver palladium conductor paste are important criteria for evaluating its quality and applicability. The following are common performance indicators:
1. Silver/palladium ratio: According to actual needs, there are different choices for the ratio of silver/palladium, commonly including 97/3, 95/5, 90/10, 85/15, and 80/20. These different ratios can meet the circuit preparation requirements of different processes.
2. Solid content:
Silver palladium conductor pasteThe solid content is generally 81 ± 1%, ensuring the stability and flowability of the slurry. A higher solid content helps reduce loss and permeation issues during the preparation process.
3. Fineness: The fineness of silver palladium conductor paste is generally controlled below 10 microns, indicating that the particle size is relatively small. A smaller particle size is beneficial for obtaining a more uniform and compact conductor structure.
4. Viscosity: The viscosity of silver palladium conductor paste is usually 400 ± 100 Pa · s, which can ensure good coating properties and maintain good adhesion of the paste during the printing process.
5. Square resistance: The square resistance of silver palladium conductor paste is generally between 3-5 milliohms/□, indicating excellent conductivity. Low square resistance is one of the important characteristics of silver palladium conductor paste in circuit preparation, which can ensure efficient conduction of circuits.
Recommended usage process: In order to achieve the best thick film circuit preparation effect, the following are the recommended usage processes for silver palladium conductor paste:
1. Mixing: Before use, the silver palladium conductor slurry should be gently stirred evenly to ensure that the components are fully mixed.
2. Suggested printing thickness: The recommended printing thickness for silver palladium conductor paste is 10-15 microns, which can meet the needs of various thick film circuits.
3. Screen material and mesh size: The printing of silver palladium conductor paste requires the use of screen, and recommended screen materials include nylon screen and stainless steel screen. In terms of mesh size, British 250-300 mesh nylon wire mesh and British 260-325 mesh stainless steel wire mesh are commonly used choices.
4. Drying: After printing is completed, the circuit should be placed in a 150 ℃ oven or dried under an infrared lamp for 15 minutes. This step helps to remove volatile substances from the silver palladium conductor paste and improve the stability of the conductive layer.
5. Sintering process: The recommended sintering process is to put the printed circuit into a tunnel furnace for sintering. The peak sintering temperature is 850 ± 10 ℃, the peak holding time is 10 minutes, and the sintering cycle is 45-60 minutes. This sintering process can achieve good density and adhesion of the conductive layer.
Conclusion:
Silver palladium conductor pasteAs a commonly used circuit preparation material, it has good appearance and excellent performance indicators. In practical use, following the recommended usage process can provide more reliable guarantees for the preparation of thick film circuits. I hope this article is helpful for readers to understand silver palladium conductor paste and achieve ideal results in practical applications.
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