What are the components of solderable conductive copper paste related to the resistivity of the cured layer?

In the field of electronic packaging, the resistivity of the cured layer is an important indicator for measuring the performance of conductive copper paste. The high or low resistivity not only affects the conductivity of electronic products, but also directly affects their reliability and stability. This article will delve into the correlation between the resistivity of the cured layer and the composition of the solderable conductive copper paste, with a special mention of Advanced Institute (Shenzhen) Technology Co., LtdResearch Platinum Brand YB5109 Solderable Conductive Copper Paste.

1. Particle size and shape of copper powder

Copper powder is one of the main components of conductive copper paste, and its particle size and shape have a significant impact on electrical resistivity. Experimental data shows that the smaller the particle size of copper powder and the closer its shape is to a spherical shape, the lower the electrical resistivity of copper paste. This is because of the small particle size andSpherical copper powderCan more effectively fill gaps and form a denser conductive network.

2. Metal powder content

The content of metal powder is another key factor. In the experiment, when the mass ratio of SAC alloy powder (a reinforcing phase) to copper powder is 1:3, the conductive copper paste exhibits good performance. With the increase of metal powder content, the conductivity of the conductive paste is improved. When the metal powder content increases from 50wt% to 80wt%, the volume resistivity significantly decreases; However, when the metal powder content increases from 80wt% to 90wt%, the decrease in volume resistivity is relatively small. This indicates the existence of a percolation threshold, beyond which increasing the metal powder content has limited effect on improving conductivity, but may cause damage to other properties such as mechanical properties.

3. Types and contents of adhesives and solvents

The type and content of adhesives and solvents also have a significant impact on electrical resistivity. Different types of adhesives have different conductivity properties, and excessive content can lead to an increase in electrical resistivity. The type of solvent will affect the dispersion degree of copper powder, thereby affecting the electrical resistivity; Similarly, excessive solvent content can also lead to an increase in resistivity.

4. Types and contents of additives

The type and content of additives also affect the electrical resistivity. For example, additives such as antioxidants and preservatives may increase electrical resistivity. Therefore, careful selection and control of the types and contents of additives are necessary in formula design.

Application examples of YB5109 solderable conductive copper paste from Yanbo brand

Advanced Institute (Shenzhen) Technology Co., LtdThe research platinum brand YB5109 solderable conductive copper paste ensures its conductivity stability during the packaging process by using high-purity copper powder and fine processing technology. Experimental data shows that after multiple thermal cycles and humidity changes, its resistivity change rate remains at a low level, far below the industry standard requirements.

• Stability of conductivity: After multiple thermal cycles and humidity changes, the rate of change in electrical resistivity remains at a low level.
• Weldability: It can achieve good wetting and welding with various substrates (such as copper, gold, silver, etc.), and the welded joint has high strength and good reliability.
• Heat resistance and moisture resistance: In the high-temperature aging test and humidity cycling test, there was no significant change in its electrical resistivity and welding strength.
• Processing performance and consistency: It has good fluidity, viscosity, and printing performance, and high consistency of performance between batches.

These characteristics makeResearch Platinum Brand YB5109 Solderable Conductive Copper PasteIt has been widely used in integrated circuit packaging. By optimizing the particle size and shape of copper powder, the content of metal powder, the types and contents of binders and solvents, and the types and contents of additives, the resistivity of the cured layer can be further reduced and the performance of the conductive copper paste can be improved.

In summary, the resistivity of the cured layer is closely related to various components in the solderable conductive copper paste. Through precise formula design and processing techniques, conductive copper paste with excellent conductivity and stability can be prepared to meet the demand for high-performance materials in the field of electronic packaging.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.