The application of electronic materials with higher shielding efficiency, such as electromagnetic shielding film, conductive adhesive film, ultra-thin flexible copper-clad laminate, ultra-thin copper foil, etc

The application of electromagnetic shielding film in flexible circuit boards can effectively suppress electromagnetic interference and reduce the attenuation and incompleteness of transmitted signals in flexible printed circuit boards. It has become an important raw material for flexible printed circuit boards and is widely used in electronic products such as smartphones and tablets. At present, there are three main types of electromagnetic shielding films, namely conductive adhesive type, metal alloy type, and microneedle type.

The utilization rate of electromagnetic shielding film in flexible circuit boards (utilization rate=required area of electromagnetic shielding film/production area of flexible circuit board) has reached about 25%. The raw material formula, production process, and quality control of electronic materials such as electromagnetic shielding films are quite complex. Downstream applications have put forward higher requirements for products, which not only need to meet the requirements of shielding effectiveness, but also need to meet the requirements of lightweight, bending resistance, and high peel strength.

There is no universal production equipment, production process, or industry standards for electromagnetic shielding films and related products. To produce high-quality and stable products and ensure output, enterprises must continuously improve their production processes, upgrade and improve their self-developed key equipment and raw material formulas. With the advancement of technology, the speed of product upgrades and replacements continues to increase. Enterprises without certain technical strength, technical reserves, and industry experience will be unable to adapt to the development of the market.

The purpose of testing the electromagnetic shielding effectiveness of electromagnetic shielding film: With the increasing expectations and requirements of the public for electronic products, flexible circuit boards, as one of the main carriers of electronic products, also face higher challenges. The high-frequency and high-speed digitization of signal transmission is considered an inevitable trend in the future development of flexible circuit boards, and products are also developing towards lighter, thinner, and smarter applications, which puts higher demands on display technology, data transmission, and processing capabilities. To meet these requirements, electronic materials with higher shielding effectiveness such as electromagnetic shielding films, conductive adhesive films, ultra-thin flexible copper laminates, and ultra-thin copper foils are needed to provide support.

The most cost-effective electromagnetic shielding effectiveness testing method used is the flange coaxial testing method, which is based on the GJB6190-2008 standard. Electromagnetic shielding film is the core material for FPC to achieve electromagnetic shielding and ensure normal operation. The growth of consumer electronics, automotive electronics and other fields has driven the demand for FPC, bringing high prosperity to the electromagnetic shielding film industry.