Widely used in the packaging of electronic components such as LED die bonding with epoxy conductive silver adhesive

Encapsulation of epoxy conductive silver adhesiveIt is a conductive adhesive used in the fields of electronics and electrical appliances. It is mainly composed of epoxy resin and conductive silver powder, with epoxy resin as the binder and conductive silver powder providing good conductivity.

The main function of this encapsulated epoxy conductive silver adhesive is to provide reliable conductive connections between electronic components to ensure smooth flow of current. It is widely used in applications such as circuit boards, sensors, filters, radio frequency identification tags, electronic paper, and solar cells.

The advantages of encapsulating epoxy conductive silver adhesive include good conductivity, high durability and reliability, excellent mechanical properties, and ease of manufacturing and processing. In addition, it can maintain stable performance in harsh environments such as high temperature, low temperature, and high humidity.
Using 70-80% silver powder, 8-15% epoxy resin, 4-10% toughening agent, 0.5-2% curing agent, 0.05-0.3% promoter, 3-7% solvent, and 0.1-2% additive;
(1) Preparation of matrix;
(2) Preparation of silver paste;
(3) The production process of silver paste is used to make it Compared with existing technologies,
The present invention enablesConductive silver adhesiveThe better coordination between curing conditions and shear strength makes it more suitable for industrial production, improving production efficiency and product reliability

The encapsulation epoxy conductive silver adhesive for LED solidification is mainly used for the installation of scanning electron microscopy (SEM) and scanning probe microscopy (SPM) samples. It can be cured in a greenhouse with high adhesion and is suitable for various material samples.

in useSPI conductive silver adhesivePreviously, samples such as ceramics, glass, metals, plastics, glass fibers, etc. could be bonded without the need for special surface treatment. Conductive silver adhesive contains a small amount of special polymer, which has special adhesive properties and does not reduce its outstanding degassing performance, allowing for uniform drying. High content silver solid, with excellent air drying properties, can be easily used with bottle cap applicators. After the silver gel is dried, it can be diluted with silver gel diluent under an ultrasonic cleaner.

Product parameters: It can fully conduct electricity and bond after 24 hours at room temperature. At a temperature of 60 ℃, it can be cured in 1 hour. At 100 ℃ -150 ℃, it can be quickly cured in 15-30 minutes and achieve better adhesion. The curing time is related to the thickness of the coating, and the thicker the coating, the longer the curing time. After using the conductive silver paste, please be sure to seal and store it at around 25 ℃, away from heat sources, sparks, and open flames. The shelf life of epoxy conductive silver adhesive for LED solidification can be stored for three months after opening, and for five years without opening.