Shielding efficiency 90dB gold-plated copper foil

Gold plated copper foil is a process in which a layer of metallic nickel is chemically treated on the surface of the copper foil, and then a layer of gold is electroplated on its surface to give it good surface conductivity, increasing the shielding effectiveness to over 90dB over a wide frequency range.

Quality requirements and specifications:

Product Model XJY-25

typeGold-plated copper foil

Main material: copper foil, nickel layer, gold layer

Basic thickness 25 ± 3um

Plane resistance (Ω/⊙)<0.05

Width 500mm

Shielding efficiency>90dB

Product Usage:

The gold plating layer has high chemical stability, low contact resistance, good conductivity, easy soldering, and strong corrosion resistance, making it widely used in precision instruments, mobile electronics, printed circuit boards, integrated circuits, tube casings, electrical contacts, and other fields.