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Adhesive bonding
Stress Relaxation
Conductive Electrical Connection
Thermal Conductivity
Silver glueThe main attributes and testing methods of
Main attributes and testing methods | ||
project | characteristic | test method |
Operability | Viscosity | Viscosity tester (Brookfield/E-type) |
thixotropy | ||
Curing situation | Conversion rate | DSC |
reliability | modulus | DMA |
CTE | TMA | |
Impurity ion content | Ion Chromatography | |
evaporate | TGA | |
Moisture absorption rate | electronic balance | |
adhesion | Shear force test | |
Conductivity | resistivity | milliohmmeter |
Thermal conductivity coefficient | Thermal conductivity tester |
Silver adhesive usage process and related precautions
Storage stage description: Temperature check is required for the refrigerator
storage temperature | Silver powder precipitation | Increased viscosity |
Below -15 ℃ | More than 6 months | More than 6 months |
5℃ | About 5 days | About one month |
25℃ | 2 days | 4 days |
30℃ | Within 1 day | About 2 days |
Instructions for thawing and reheating stage: Pay attention to layering
Avoid rapid temperature rise and avoid improper handling by hand.
Suggestion:
A. -15~-25 ℃ storage, directly return to room temperature
Warm up time: 5cc 1h 10cc 1h 30cc 2h
B. -35~-45 ℃ storage
First reheating to 0~-20 ℃ for 2 hours
Second reheating to room temperature 10cc 1h 30cc 2h
Glue dispensing/coating: Multiple processes are implemented without any indication.
Curing process:
Problems with solidification | ||
abnormal | Possible reasons | Inspection items |
Insufficient shear force | Improper curing conditions | Temperature of the bracket during solidification |
contamination | There is an abnormality in the exhaust system | Oven exhaust conditions |
Curing conditions | ||
empty | Volatile causes | Curing conditions (increase heating time) |
diffuse | Improper curing conditions | Curing conditions |
Explanation of bracket temperature during curing:
The actual temperature does not match the set temperature, which may be due to the following factors:
A. Oven capability itself
B. Number of material boxes accommodated during baking
C. Location and spacing of oven material box visits
D. The material, wall thickness, and openings of the material box itself
Therefore, it is necessary to edit the baking program according to the actual situation.
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