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Industry news

The use process and related precautions of conductive silver adhesive

Time:2022-10-16Number:3098

  1. Adhesive bonding

  2. Stress Relaxation

  3. Conductive Electrical Connection

  4. Thermal Conductivity

Silver glueThe main attributes and testing methods of

Main attributes and testing methods
project characteristic test method
Operability Viscosity Viscosity tester (Brookfield/E-type)
thixotropy
Curing situation Conversion rate DSC
reliability modulus DMA
CTE TMA
Impurity ion content Ion Chromatography
evaporate TGA
Moisture absorption rate electronic balance
adhesion Shear force test
Conductivity resistivity milliohmmeter
Thermal conductivity coefficient Thermal conductivity tester

Silver adhesive usage process and related precautions

Storage stage description: Temperature check is required for the refrigerator

storage temperature Silver powder precipitation Increased viscosity
Below -15 ℃ More than 6 months More than 6 months
5℃ About 5 days About one month
25℃ 2 days 4 days
30℃ Within 1 day About 2 days

Instructions for thawing and reheating stage: Pay attention to layering

Avoid rapid temperature rise and avoid improper handling by hand.

Suggestion:

A. -15~-25 ℃ storage, directly return to room temperature

Warm up time: 5cc 1h 10cc 1h 30cc 2h

B. -35~-45 ℃ storage

First reheating to 0~-20 ℃ for 2 hours

Second reheating to room temperature 10cc 1h 30cc 2h

Glue dispensing/coating: Multiple processes are implemented without any indication.

Curing process:

Problems with solidification
abnormal Possible reasons Inspection items
Insufficient shear force Improper curing conditions Temperature of the bracket during solidification
contamination There is an abnormality in the exhaust system Oven exhaust conditions
Curing conditions
empty Volatile causes Curing conditions (increase heating time)
diffuse Improper curing conditions Curing conditions

Explanation of bracket temperature during curing:

The actual temperature does not match the set temperature, which may be due to the following factors:

A. Oven capability itself

B. Number of material boxes accommodated during baking

C. Location and spacing of oven material box visits

D. The material, wall thickness, and openings of the material box itself

Therefore, it is necessary to edit the baking program according to the actual situation.

导电银胶

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