Applied to bonding electrode plates and magnetic crystal conductive silver paste in ferroelectric devices

Conductive silver adhesiveIt is one of the key materials for tile stacking components, composed of conductive particles and polymer matrix. The former determines conductivity, while the latter serves as a carrier for conductive particles, determining the curing speed, adhesion, and aging resistance of the conductive adhesive. According to the different polymer matrices, conductive adhesives can be divided into acrylic system, epoxy system, organosilicon system, and organofluorine system. The coating methods of conductive silver glue include spiral dispensing, spray dispensing and screen printing.

Conductive silver adhesive is a special adhesive that combines adhesion and conductivity, usually composed of a resin matrix and conductive fillers. Compared with Pb Sn solder, the advantages of conductive silver paste are:

1. High line resolution, suitable for finer lead spacing and high-density I/O assembly, with low self density, meeting the development requirements of miniaturization and lightweighting of microelectronic products;

2. It does not contain toxic metals such as lead, and does not require pre cleaning or residual cleaning during the interconnection process. It is an environmentally friendly adhesive;

3. Can be connected at low temperatures, especially suitable for interconnecting thermal sensitive components;

4. Good flexibility and fatigue resistance;

5. It can interconnect different substrates, including ceramics, glass, and other non solderable surfaces. Therefore, conductive adhesive is considered as a connecting material in the next generation of electronic packaging.

Disadvantages of conductive silver paste:

1. The conductivity is very low. At present, the volume resistivity of most conductive adhesives still remains at 10-3-10-4cm, which is far from the solder joint (1.5l0-5cm), and the poor thermal conductivity limits the use of conductive adhesives in power components;

2. Poor stability of contact resistance. In humid and hot environments, the contact resistance of conductive adhesive joints increases rapidly over time.

3. Poor mechanical properties of bonding;

　　4.conductive filler(such as silver in silver powder conductive adhesive) is prone to migration. The above-mentioned drawbacks of conductive adhesives greatly limit their application in certain fields, so lead tin alloy solder and other alloy solder are still widely used in electronic surface packaging. Therefore, improving the performance of conductive adhesives and expanding their application scope has become an important topic in this research field.

Application of conductive silver adhesive:

　　1.Conductive silver adhesiveUsed for microelectronic assembly, including connecting fine wires and printed circuits, electroplating substrates, ceramic adhesive metal layers, metal chassis, bonding wires and sockets, bonding components and planar holes passing through printed circuits, bonding waveguide tuning, and hole repair.

When the welding temperature exceeds the tolerance of the oxide film formed by welding, use conductive adhesive instead of spot welding. Conductive adhesive, as a substitute for tin lead solder, is mainly used in telephone and mobile communication systems. Broadcasting, television, computer and other industries; Automotive industry; Medical equipment; Resolve electromagnetic compatibility (EMC) and other related issues.

        3.Conductive silver adhesiveAnother application is to bond electrode plates and magnet crystals in ferroelectric devices. Conductive adhesive can replace welding. In welding, due to the welding temperature, flux and crystals are prone to deposition. When the welding temperature is unfavorable, bonding battery terminals is another use of conductive adhesive.

4. Conductive silver adhesive can form joints with sufficient strength, making it suitable for use as structural adhesive.

Advanced Institute (Shenzhen) Technology Co., LtdFounded in Shenzhen in 2016, the company relies on higher education institutions such as China University of Petroleum, Hunan University, and Central South University. It has an independent research and development team, gathers numerous industry elites and leading talents in the field of new materials, and has technical experts such as 2 "Thousand Talents Plan" experts and 4 doctoral supervisors. Our main products include electromagnetic shielding materials and devices, conductive materials, thermal conductive materials and devices, and other electronic devices. We are a leading and innovative provider of electromagnetic shielding and thermal conductivity solutions today. We have established production bases in Shenzhen and Dongguan, and set up multiple offices in various regions to provide convenient electromagnetic shielding and thermal conductivity service application solutions for global customers.

The company injects the Industry 4.0 concept and the Made in China 2025 action plan into product development and manufacturing, adhering to the basic principles of "innovation driven, quality first, green development, structural optimization, and talent oriented", pursuing excellence, helping customers create value, and making high-quality products widely used in mobile terminals, communication equipment, computers, automotive electronics, household appliances, and other fields.

The company adheres to innovation driven development, focuses on creating lean products with craftsmen, and strives to become a comprehensive research and development supplier of electromagnetic shielding materials and devices, thermal conductive materials and devices, and other electronic devices in China.