Optical field, optical lens, camera module sealing and fixing, low-temperature curing silver adhesive

Low temperature curing adhesiveIt is an adhesive made of epoxy resin binder, curing agent, and accelerator. Due to its good adhesion, simple bonding process, minimal curing shrinkage, and low environmental harm, it is widely used in various industries. Because the quality of products depends on the technical capabilities and problem-solving experience of each production enterprise, many users of low-temperature curing adhesives still encounter different problems during use.

Low temperature curing adhesiveIt can quickly cure at lower temperatures, has excellent adhesion to most substrates, and does not damage heat-resistant electronic components. It is a single liquid modified epoxy resin adhesive. Low temperature curing adhesives have unparalleled excellent properties and a wide range of applications. In this article, low temperature generally refers to the curing of epoxy resin adhesive at 60, 70, and 80 degrees. For example, most SMT red adhesive is cured at 150 degrees, and there are also those cured at 120 degrees. The 120 degree curing adhesive here belongs to low-temperature curing adhesive. The bonding process of epoxy resin adhesive includes several steps such as impregnation, bonding, and curing, which is a complex physical and chemical process that generates cured products with three-dimensional cross-linked structures, integrating the bonded products into one. With the miniaturization and precision of electronic technology, the relatively high temperature curing condition of 120 degrees is becoming increasingly unsuitable for many precision electronic components and LED components, leading to the widespread application of low-temperature curing adhesives.

Compared with 120 degree high-temperature curing adhesive, low-temperature curing epoxy resin adhesive has the following characteristics: 1. It has excellent adhesion and bonding to most materials; 2. High and low temperature resistance, able to withstand high temperatures through SMT reflow soldering/wave soldering; 3. Resistant to impact and aging, able to pass the Double 85 condition test; 4. Very small coefficient of linear expansion and volume shrinkage rate; 5. Long dispensing operation time, good environmental adaptability, ultra fast curing in 10 minutes, meeting high efficiency production requirements.

Low temperature curing adhesive is suitable for industrial applications: 1. Sealing and fixing of optical fields, optical lenses, and camera modules; 2. In the field of chips, the fixation, bottom filling protection, and reinforcement of IC/chip BGA packaging; 3. Adhesive fixation and protection of LED components such as PC lenses, LED backlight strips, and LED bead light sources; 4 PCB/FPC, In the field of circuit boards, the fixation, sealing, and confidentiality protection of heat-resistant circuit board components; 5. In the field of sensors, the protection, fixation, and sealing of some precision sensors, such as thermal and photosensitive temperature sensors; 6. The sealing, protection, and bonding of precision electronic components, such as some electronic relays made of high-temperature resistant materials.

useLow temperature curing adhesiveAttention: Due to the characteristics of low-temperature curing adhesive, it is a thermosensitive adhesive that requires high temperature control in production, transportation, storage, and use. During the transportation and distribution process, professional cold chain distribution packages are required, and the customer's warehouse needs to immediately carry out targeted refrigeration and storage after receiving the goods. The production and use environment should avoid high temperatures, and the ambient temperature should not exceed 30 degrees. Unused glue should be immediately sealed and refrigerated. Due to long-term refrigeration, the glue should be stored at room temperature for 2 hours before use, and care should be taken to prevent water vapor from entering the glue solution.