The production method of inner layer gold conductor paste for LTCC

Used for LTCCInner layer gold conductor pasteThe production method of gold fittings has high chemical stabilityGold pasteAfter sintering in air, conductors with excellent conductivity can be formed, and they have excellent hot press welding performance and corrosion resistance. They are usually used in places that require high reliability and stability, such as aerospace, military engineering, medical equipment, computers, and satellite communications. Ltcc (low-temperature co fired ceramic) technology has become the mainstream technology for passive integration, which is easy to achieve more wiring layers and has become the development direction of the passive component field and a new economic growth point for the component industry. Electronic components manufactured using the ltcc process have become the preferred way for electronic component integration and modularization due to their excellent performance, high reliability, good consistency, compact structure, small size, and light weight, as well as their outstanding electronic, mechanical, and thermal characteristics. They have been widely used in military, aerospace, computer, and other fields.

The inner layer gold conductor paste used in the si system ltccGold powderDuring the production process, on one hand, the existing gold powder prepared by reducing agents such as ascorbic acid and sodium sulfite is prone to warping and unevenness when co fired with LTCC ceramic strips in the Si system; On the other hand, due to the requirements for dispersibility and particle size of gold powder, a large amount of dispersant needs to be introduced. However, during the later water washing process, the dispersant is difficult to remove and remains on the surface of the gold particles, resulting in different batches ofInner layer gold conductor pasteWhen co firing with ltcc film strips, there is a tendency for surface bubbles or porosity within the sintered body, resulting in delamination of the sintered body of the component, greatly reducing the electrical performance, stability, and service life of ltcc components.