Inner silver conductor pasteIt is one of the most fundamental key materials in modern electronic industry and the core functional material that makes up electronic devices.
electronic pasteWidely used in various types of electronic components, including chip resistors, chip capacitors, chip inductors, thick film integrated circuits, semiconductor packaging, etc., it is widely used in fields such as mobile communication, Internet of Things, aerospace, solar photovoltaics, automotive appliances, LED lighting, flexible electronics, etc. Electronic pastes are mainly classified into conductor pastes
resistor pasteMedium slurry. Among them, conductor paste is the most widely used electronic functional material, mainly divided into high-temperature sintered conductor paste and low-temperature cured conductor paste. High temperature sintered conductor paste is usually composed of conductive powders (gold, silver, palladium, platinum, copper, aluminum, tungsten, molybdenum and their alloys), glass powders (microcrystalline glass powders such as Pb, Bi, Ca, etc.), oxides (oxides of Cu, mg, Zr, Zn, Ni, rare earths, etc.), organic resins (cellulose, acrylic acid, polyvinyl butyraldehyde, etc.), organic solvents (turpentine alcohol, butyl carbinol, butyl carbinol ester, divalent acid ester, alcohol ester twelve, etc.), surfactants, thixotropes, etc. By using screen printing technology to create circuit graphics, functional conductive circuits are formed through high-temperature sintering.
With the rapid development of electronic product technology, electronic components, especially passive chip components, are moving towards miniaturization and precision. Chip resistors are an important component of the three major passive chip components, mainly composed of aluminum oxide substrate, front silver electrode, back silver electrode
resistor pasteFunctional devices made by multiple screen printing and sintering processes, including primary encapsulation glass, secondary encapsulation resin paste, and character code paste. Due to the trend of miniaturization of chip resistors, the distance between electrodes during the manufacturing process of chip resistors is getting smaller and smaller, which makes it easy for silver migration to occur, leading to the failure of chip resistors.
Currently, most chip resistor manufacturers use palladium silver paste products to improve the electrode's resistance to silver migration.
Advanced Institute of TechnologyAn anti silver migration
Anti sulfide silver electrode pasteAnd its preparation method is used to improve the silver migration problem, but this method has high cost and poor anti silver migration effect.
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