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Inorganic additivesSilver through-hole pasteThe effect of oxide or glass powder added to through-hole silver paste on the co firing behavior of the paste and Ferro A6 raw material was studied by direct observation using scanning electron microscopy The results indicate that without the addition of inorganic additives, the low melting point substances in the raw material belt will phase towards each otherSilver through-hole electrodeInfiltration; Adding SiO2 with a mass fraction of 10% can hinder permeation and form a protruding transition layer at the interface between the electrode and the ceramic pores; When glass powder is added instead of SiO2, reverse osmosis occurs; Adding 1% to 4% glass powder by mass to the slurry can effectively prevent the infiltration of low melting point phases, and the block resistance of the slurry also meets the electrical performance requirements of the silver through-hole slurry for components Through hole silver paste is a series of materials that are compatible with low-temperature co fired ceramic (LTCC) substrateselectronic pasteIt is an essential material with high requirements for silver powder Silver powder was prepared using ascorbic acid reduction system. The effects of silver nitrate solution concentration, pH value, and reducing agent concentration on the morphology and particle size distribution of silver powder were studied. Scanning electron microscopy was used to characterize and analyze the prepared silver powder. Three different types of silver powder were selected to prepare through-hole silver paste for compatibility testing The results indicate that spherical silver powder with good uniformity, dispersibility, and an average particle size of 2.0 μ m has good potential for application
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