Conductive silver adhesive used for microelectronic assembly, including thin wires and printed circuits, electroplated substrates, and ceramic adhesives

Adding mineral powder materials to adhesives can increase their viscosity,

Conductive silver adhesiveIt is required that the conductive particles themselves have good conductivity and the particle size should be within an appropriate range, which can be added to the conductive silver gel matrix to form a conductive path. Conductive fillers can be powders of gold, silver, copper, aluminum, zinc, iron, nickel, graphite, and some conductive compounds. The commonly used conductive silver adhesive filler for Die bond is silver powder.

Touchscreen conductive silver pasteReduce thermal expansion coefficient, decrease shrinkage, improve impact resistance and mechanical strength, while reducing production costs. Some polymer molecules have weak intermolecular interactions and low cohesive energy, resulting in low mechanical properties. Choosing appropriate particle size fillers can have a reinforcing effect. Due to the active surface energy of the filler particles, they can combine with several large molecular chains to form a cross-linked structure.

Reactive polyurethane hot melt adhesive, as a new generation of high-performance adhesives,

due toConductive silver adhesiveThe matrix resin is an adhesive that can be bonded at an appropriate curing temperature. For example, epoxy resin adhesive can cure at room temperature to 150 ℃, which is much lower than the welding temperature of over 200 ℃ for tin lead welding. This avoids material deformation, thermal damage to electronic devices, and the formation of internal stress that may be caused by high welding temperatures.

Touchscreen conductive silver paste has broad application fields and development prospects. With the continuous promotion of its industrialization, it will bring a new leap to the field of adhesive application. In production lines that require fast, automatic, labor-saving, and solvent-free production, reactive polyurethane hot melt adhesive is gradually being widely applied, not only as an adhesive, but also as a sealing agent.

Currently, silver powder filled conductive adhesive is commonly used.

Conductive silver adhesiveUsed for microelectronic assembly, including thin wires and printed circuits, electroplated substrates, metal layers of ceramic adhesives, metal chassis connections, bonding wires and sockets, bonding components and flat holes passing through printed circuits, bonding waveguide tuning, and hole repair Conductive silver adhesive is used to replace spot welding where the welding temperature exceeds the tolerance of the oxide film formed during welding Conductive silver adhesive as a substitute for tin lead solder

Conductive silver paste is used for touch screens, and in some situations where conductivity is not very high, copper powder filled conductive adhesive is also used. After adding a certain metal filler or conductive carbon black to synthetic resin, it becomes conductive. Carbon can be any amorphous carbon, such as acetylene black or crushed graphite powder.