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PI electroplated tin film PET electroplated tin film PP electroplated tin filmThe coating of chromium electroplating materials has the advantages of high hardness, good wear resistance, and corrosion and turbidity resistance. However, the hardness of the chrome plating layer will decrease at high temperatures, and there will be crack structures when the coating thickness is greater than 0.7 μ m. At this time, the protective effect of the electroplating material on the substrate will be weakened. Chromium alloy coating is more wear-resistant, corrosion-resistant, and high-temperature resistant than chromium coating. Metals that can co deposit with chromium to form alloys include iron, cobalt, nickel, molybdenum, tungsten, vanadium, manganese, etc. The early electroplating of chromium alloys was generally carried out in chromate or chromium sulfate solutions. Later on, there was also a process of electroplating chromium alloys using trivalent chromium as the main salt.
Electroplated chromium nickel alloys have almost the same properties as cast and forged chromium nickel alloys. It has the characteristics of wear resistance, corrosion resistance, high temperature resistance, and high resistance.
Electroplating iron chromium nickel ternary alloy can obtain an alloy coating similar to stainless steel, which has the properties of stainless steel and is naturally widely used in practical applications.
The chromium molybdenum alloy coating has a dense structure and excellent corrosion resistance and wear resistance.
List of Tin Plated Products
| Plating type | Item number | brief introduction | |
| sulfur |
Rolling and hanging plated with fully bright pure tin | NF-750 NF-760 |
It is a product developed and launched by us 18 years ago. This process has stable plating solution and good weldability. It is still widely used as a tin plating brightener for rectifier diode manufacturers at home and abroad. |
| Rolling and hanging plated with fully bright pure tin | SGT-20 SGT-21 |
It is an upgraded formaldehyde free and environmentally friendly product based on NF-750/760 in recent years. The coating has a bright mirror finish, excellent weldability, and ductility, and the coating has good color resistance. It is more convenient to add and use as a single agent; Adopting low tin opening and low production cost, with minimal loss, it is versatile for rolling and hanging plating. | |
| Rapid electroplating of fully bright pure tin | N-750X N-760X |
It is a brightener used for rapid electroplating of pure tin on wire terminals, connectors, tinned copper wires, copper-clad steel wires, copper strips, and other wires and strips. It has fast light output, fast deposition speed, and high production efficiency. | |
| Rapid electroplating of matte pure tin | NF-770K NF-780K | It is an additive used for rapid electroplating of matte pure tin on strip and wire such as wire terminals, connectors, tinned copper wires, copper-clad steel wires, etc. It has fast light output, fast deposition speed, and high production efficiency. | |
| Organic acid electroplating | Rolling and hanging matte pure tin and tin based alloys (tin bismuth, tin copper, tin lead) | M-770S | It is an additive for our company's large-scale export of organic acid electroplating matte pure tin, or tin bismuth, tin copper, tin lead alloys. This process can obtain a whole matte pure tin coating within a wide range of current density from high to low battery areas. The coating is soft and finely crystallized, with low carbon content, excellent ductility, uniformity, and weldability. Compatible with matte additives of equivalent types in the United States, Germany, and Japan, it is adopted by MSA/B/C, Sub/Fold, TO, GBU, and KBG products of large domestic and foreign companies. |
| Rapid electroplating of bright pure tin | M-750K M-760K |
It is a brightener used for rapid electroplating of pure tin on strip and wire such as wire terminals, connectors, tinned copper wires, copper-clad steel wires, etc. It has fast light output, fast deposition speed, and high production efficiency. | |
| Rapid electroplating of matte pure tin | M-770K M-780K |
It is an additive used for rapid electroplating of matte pure tin on strip and wire such as wire terminals, connectors, tinned copper wires, copper-clad steel wires, etc. It has fast light output, fast deposition speed, and high production efficiency. | |
| centre |
Rolling and hanging semi glossy pure tin plating | HSN-750 HSN-760 |
Used for electronic components such as glass, ferrite, ceramic multilayer capacitors, low-temperature ceramic filters, resistors, inductors, etc. that are not suitable for acid-base electroplating. Rolling and hanging semi gloss neutral tin plating process. The stability of the plating solution is very good, it is not easily hydrolyzed and turbid, and the weldability is excellent. |
| Neutral activator | HSN-650 | Used for the removal and activation of oxide films before nickel plating on electronic components that are not suitable for acid-base electroplating, as well as the activation process before direct tin plating after nickel plating. | |
| assist |
neutralizer | P.S.T | Used for neutralization after electroplating, thoroughly cleaning, extending storage period, and preventing coating discoloration. |
| Residual adhesive remover | 5H | Hot soaking is used to remove black glue overflow from semiconductor devices such as DO-41 axial plastic diodes. | |
| Residual adhesive remover | 6H | Hot soaking is used to remove white glue and color glue overflow from plastic sealed light-emitting diodes, commonly known as blue solution | |
| Go fly edge (overflow) liquid | F-21 | Used for hot soaking and cleaning of plastic seal overflow in STO-23, Folded SMA, Sub SMA surface mount devices, as well as discrete electronic components such as TO-220, TO-3P, TO-126, TO-92, DO-41, etc. | |
| Pre plating treatment agent | TH-311 | Soak before electroplating, and perform acid washing, oxidation removal, polishing, and activation on the surface of the lead frame in one go. | |
| Automatic line electroplating pre-treatment agent | TH-311X | Acid washing, oxidation removal, polishing and activation of frames and leads on the electroplating production line can be completed in one go | |
| Character remover | K-51 | Removing DV printing ink from semiconductor devices | |
| Character remover | K-61 | Special for removing hot drying printing ink from semiconductor devices | |
| Tin removal solution | K-71 | Chemical removal of defective tin and tin lead alloy coatings | |
| Copper micro etchant | Copper-85 | Suitable for pickling the frame after soldering the device chip, making the surface of the frame flat, bright, and oxidation free | |
| Electrolytic stripping solution | E-20 | Used for electrolytic stripping of tin deposits on rollers and hangers on electroplating automatic production lines. | |
| High speed chemical tin plating solution | D-860 | Suitable for tin plating and refurbishment of PCB circuit boards, logic integrated circuits, and old electronic components. |
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