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Advanced Institute of Technology Semiconductor Packaging Conductive Adhesive Formally Widely Used

Time：2022-04-20Number：1593

currentlyAdvanced Institute Technology CompanysemiconductorEncapsulation conductive adhesiveThe product can be used for bonding and packaging related chips and modules for downstream applications such as display lighting, automotive, aviation, high-performance computing, data centers, consumer electronics, 5G, IoT, military, etc. It is currently in the stage of product promotion and has already formed sales

Silver aluminum conductive adhesiveIt is a conductive sealing material filled with silver coated aluminum powder in the form of a single component silicone elastomer. The product has superior conductivity, simple operation process, and is suitable for FIP dispensing to various base stations, PC cards, radios, mobile phones, and many other electronic components with cast casings and packaging are also suitable for military communications and autonomous vehicle fields!

Application scope

Mainly used in various communication base stations, unmanned vehicles, aerospace, and military industries for electromagnetic wave anti-interference and electromagnetic wave radiation blocking.

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Advanced Institute of Technology Semiconductor Packaging Conductive Adhesive Formally Widely Used

Application scope