Application of Organic Conductive Adhesive in Low Temperature Curing Polymer Thick Film Conductive Slurry and Conductive Coating Analysis

Organic conductive adhesiveMainly used for low-temperature curing polymer thick filmsconductive pasteAnd conductive coatings.

The main components are as follows:
(1) Conductive powder, as a conductive phase filler, has the same product types asInorganic conductive adhesive type slurryConductive powder.
(2) The main function of adhesive is to aggregate conductive particles together, bond them to the substrate, and protect the conductive particles. Common organic conductive adhesives include thermosetting organic resins (phenolic resin, melamine formaldehyde resin, epoxy resin, polyurethane, organosilicon, polyacrylate, etc.) and thermoplastic organic resins (polyurethane, polyacrylate, polyimide, etc.).
(3) The function of solvents is to dissolve adhesives and adjust the viscosity of the slurry system, mainly including diethylene glycol monoether, turpentine alcohol, etc.
In addition, surfactants and rheology agents are added to the slurry to control the rheological properties of the slurry components. According to their main roles in the slurry system, they can be divided into anti settling agents, thickeners, coupling agents, etc; The addition amount of surfactants and rheology agents is generally 1% to 5% of the carrier mass.
slurry
According to the curing temperature and organic components, organic adhesives can be divided into four types: room temperature curing single component type, such as polyacrylic acid resin adhesive; Room temperature curing two-component type, such as epoxy resin adhesive; Medium temperature curing single component types, such as phenolic resin adhesives and epoxy resin adhesives; Medium temperature curing two-component type, such as epoxy resin adhesive and polyurethane adhesive.