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Copper has similar conductivity to silver and is inexpensive, making it an ideal substitute material for silver. Due to the active chemical properties and easy oxidation of copper powder, it is not conducive to industrial applications. Silver plating with copper powder can solve this problem and achieve good results.
Our company producesFlake Silver Coated Copper PowderAdvanced chemical plating technology has been adopted. The ultrafine powder with uniform particle size and excellent oxidation resistance obtained by forming silver coatings of different thicknesses on the surface of silver coated copper powder, and then undergoing certain forming and processing processes, is an ideal conductive powder.
Silver content |
Average particle size (D50, μ m) |
shape |
colour |
3%,5%,8%,10% |
13-17 |
Flaky |
Copper red → Silver gray (with increasing silver content) |
3%,5%,8%,10% |
7 |
branch |
Copper red → Silver gray (with increasing silver content) |
3%,5%,8%,10% |
12 |
branch |
Copper red → Silver gray (with increasing silver content) |
3%,5%,8%,10% |
30 |
branch |
Copper red → Silver gray (with increasing silver content) |
3%,5%,8%,10% |
45 |
branch |
Copper red → Silver gray (with increasing silver content) |
3%,5%,8%,10% |
1 |
sphere |
Copper red → Silver gray (with increasing silver content) |
3%,5%,8%,10% |
2.5 |
sphere |
Copper red → Silver gray (with increasing silver content) |
3%,5%,8%,10% |
3.5 |
sphere |
Copper red → Silver gray (with increasing silver content) |
Spherical silver coated copper powder is usually prepared by ball milling of shaped powder, coating with sheet-like copper powder, etc; Good stability, good antioxidant performance, and good two-dimensional conductivity.
Silver plating on flake copper powder is somewhat difficult, and Fudi has conducted research on the preparation process and antioxidant properties of silver plating on copper powder. The experimental results show that after special treatment on the surface of copper powder, dotted silver particles are generated, and then the silver particles grow. The incomplete silver coating on the surface of copper powder, the excess silver ions in the solution under the action of reducing agent, further grow the surface silver layer, and obtain copper powder completely coated with silver. Through X-ray diffraction analysis, no oxide was found on the surface of the silver plated layer of the sheet-like copper powder, and the surface structure of the obtained powder was dense. The silver plated layer of branch copper powder has good resistance to high temperature oxidation.
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