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Industry news

Preparation principle and usage process of silver palladium slurry for co fired internal electrodes, silver palladium slurry for sheet resistors, silver palladium slurry for sensors

Time:2022-03-01Number:2071

MLCC palladium silver internal electrode pasteIt is mainly composed of palladium silver powder, organic carrier, and inorganic additives The experiment shows that the palladium content in palladium silver powder determines the firing temperature and cost price of the slurry; The function of organic carriers is to provide certain rheological properties of the slurry to meet the process requirements of MLCC screen printing. The degree of thixotropy of organic carriers directly affects the quality of the slurry screen printing graphics; The function of inorganic additives is to suppress the rapid shrinkage of the slurry during the firing process. Choosing different inorganic additives can adjust the matching of the firing shrinkage rate between the electrode layer and the dielectric layer formed by the slurry during the firing process, avoiding quality problems such as electrode cracking caused by matching problems in MLCC products

A silver palladium powder with a palladium silver ratio of 5/95 was prepared, and a mixed system of ethyl cellulose and alkyd resin was used as the organic carrier. A small amount of glass powder was added to obtain a high-performance silver palladium powderInternal electrode silver palladium slurryCan be used on piezoelectric ceramic speakers

Scope of application:

This slurry is suitable for external labeling and outer packaging of circuits and resistors, and can be used for substrates such as glass, ceramics, stainless steel, aluminum alloys, etc

The paste is suitable for marking thick film circuit and outside package, glass, ceramic, metal, etc.

Usage conditions/Operating conditions:

base material

Substrate

Thick film circuits, glass, ceramics, metals, etc

thick film circuit, glass, ceramic, metal, etc.

Usage

Method of use

Printing, 200-250 mesh

Printing, 200-250mesh

leveling

Levelling

5-10min minutes at room temperature

Level at room temperature for 5-10 minutes (depending on the actual leveling situation).

bake

Curing conditions

Bake in a ventilated oven at 100-150 ℃ for 10-15 minutes

(If the air test temperature is below 300 ℃, the baking time can be determined according to the actual baking situation.) 100-150 ℃ for 10-15 minutes

Sintering in tunnel furnace air atmosphere, peak temperature 550 ± 10 ℃ (recommended value), 10 minutes.

sinter

(The sintering range can be adjusted within 530-650 ℃ according to actual needs, but the peak temperature time must be 10 minutes.)

Firing Condition

Atmospheric firing in belt furnace with peak time of 9-11 Minutes at 550±10℃

(According to actual needs, sintering range can be adjusted within 530-650℃)

thinner

Thinner

ST-1001

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