Detailed explanation of the preparation process of conductive silver copper adhesive in one article

Step 1 Preparation of Matrix Resin: The laboratory uses an electronic balance to weigh a certain amount of epoxy resin in a certain proportion and place it in a mortar. K77 ZE4MzeN、 Peng 560 and DleY (pre ground and sieved through a 200 mesh sieve) are thoroughly ground and mixed using a grinding rod for at least 10 minutes until a uniform mixture is formed, resulting in the desired resin matrix.

The properties of the cured product obtained from the matrix resin can fully meet the requirements of commercial conductive silver copper adhesive, and the amount of silver powder added in the conductive silver copper adhesive is related toConductive silver adhesiveThe impact of performance will be an important factor determining whether conductive silver paste can be commercialized. Scholars have already commented onConductive silver powderAfter in-depth research on the filling amount of conductive silver powder, it is generally believed that a filling amount of less than 70% results in poor conductivity of the cured product and cannot meet commercial requirements. However, if the filling amount of silver powder exceeds 80%, the shear strength of the cured product deteriorates and cannot meet commercial requirements. Based on the above considerations, this paper prepares three types of conductive silver adhesives with silver powder contents of 70%, 75%, and 80%, and comprehensively investigates their properties to determine the appropriate silver powder content for conductive silver adhesives suitable for LED packaging.

Step 2 Preparation of Conductive Silver Adhesive: Take a certain amount of resin matrix and add some of the already mixed flake silver powder BAgF-20 and granular silver powder sAg-ZA for grinding until all the silver powder is evenly mixed with the resin matrix. Then add an appropriate amount of silver powder, with the total amount of silver powder accounting for 70% of the total adhesive amount; Take a certain amount of resin matrix and prepare a conductive silver paste with a silver powder content of 75% using the aforementioned method; Take a certain amount of resin matrix and prepare a conductive silver paste with a silver powder content of 80% using the aforementioned method; After adding all the silver powder, grind it for more than 30 minutes until a uniform silver white paste mixture is formed between the silver powder and the resin based conductive silver adhesive preparation and performance test sample in Chapter 2. Conduct performance tests on three different silver powder content conductive silver adhesives prepared according to the following method.

1.Conductive silver copper adhesiveUsed for microelectronic assembly, including thin wires and printed circuits, electroplated substrates, metal layers of ceramic adhesives, metal chassis connections, bonding wires and sockets, bonding components and flat holes passing through printed circuits, bonding waveguide tuning, and hole repair

2.Step 1 Preparation of Matrix Resin: The laboratory uses an electronic balance to weigh a certain amount of epoxy resin in a certain proportion and place it in a mortar. K77 ZE4MzeN、 Peng 560 and DleY (pre ground and sieved through a 200 mesh sieve) are thoroughly ground and mixed using a grinding rod for at least 10 minutes until a uniform mixture is formed, resulting in the desired resin matrix.

The properties of the cured product obtained from the matrix resin can fully meet the requirements of commercial conductive silver paste. The influence of the amount of silver powder added to the conductive silver paste on its properties will be an important factor in determining whether the conductive silver paste can be commercialized. Scholars have conducted in-depth research on the amount of conductive silver powder added. It is generally believed that when the amount of conductive silver powder added is less than 70%, the resulting cured product has poor conductivity and cannot meet commercial requirements. However, when the amount of silver powder added exceeds 80%, the shear strength of the cured product deteriorates and cannot meet commercial requirements. Based on the above considerations, this paper prepares three types of conductive silver adhesives with silver powder contents of 70%, 75%, and 80%, and comprehensively investigates their properties to determine the appropriate silver powder content for conductive silver adhesives suitable for LED packaging.

Step 2 Preparation of Conductive Silver Adhesive: Take a certain amount of resin matrix and add some of the already mixed flake silver powder BAgF-20 and granular silver powder sAg-ZA for grinding until all the silver powder is evenly mixed with the resin matrix. Then add an appropriate amount of silver powder, with the total amount of silver powder accounting for 70% of the total adhesive amount; Take a certain amount of resin matrix and prepare a conductive silver paste with a silver powder content of 75% using the aforementioned method; Take a certain amount of resin matrix and prepare a conductive silver paste with a silver powder content of 80% using the aforementioned method; After adding all the silver powder, grind it for more than 30 minutes until a uniform silver white paste mixture is formed between the silver powder and the resin based conductive silver adhesive preparation and performance test sample in Chapter 2. Conduct performance tests on three different silver powder content conductive silver adhesives prepared according to the following method.

1. Conductive silver adhesive is used for microelectronic assembly, including thin wires and printed circuits, electroplated substrates, metal layers of ceramic adhesives, metal chassis connections, bonding wires and sockets, bonding components and flat holes passing through printed circuits, bonding waveguide tuning, and hole repair

2.Conductive silver adhesiveUsed to replace spot welding where the welding temperature exceeds the tolerance for forming oxide films due to welding Conductive silver adhesive, as a substitute for tin lead solder, is mainly used in telephone and mobile communication systems; Broadcasting, television, computer and other industries; Automotive industry; Medical equipment; Resolve electromagnetic compatibility (EMC) and other related issues

Another application of conductive silver adhesive is for bonding electrode plates and magnetic crystals in ferroelectric devices Conductive silver adhesive can replace welding flux and crystals that tend to deposit due to welding temperature The bonding of battery terminals is another use of conductive silver adhesive when the welding temperature is unfavorable

4. Conductive silver adhesive can form joints with sufficient strength, therefore, it can be used as a structural adhesive

Adhesive is used to replace spot welding where the welding temperature exceeds the tolerance of the oxide film formed during welding Conductive silver adhesive, as a substitute for tin lead solder, is mainly used in telephone and mobile communication systems; Broadcasting, television, computer and other industries; Automotive industry; Medical equipment; Resolve electromagnetic compatibility (EMC) and other related issues

Another application of conductive silver paste copper adhesive is for bonding electrode plates and magnet crystals in ferroelectric devices Conductive silver adhesive can replace welding flux and crystals that tend to deposit due to welding temperature The bonding of battery terminals is another use of conductive silver adhesive when the welding temperature is unfavorable

4. Conductive silver adhesive can form joints with sufficient strength, therefore, it can be used as a structural adhesive