Case analysis of thermal management solution for 5G communication equipment

01. The arrival of the 5G era

With the advent of big data and efficient network era, 5G technology has gradually become popular in 2020, and the capacity, transmission speed, and processing requirements of modern communication will be higher than ever before. The transition from wired to fiber optic connections between data centers and racks puts enormous pressure on production process technology and increases the heat generated by high-speed and large data volumes.

By using new thermal conductive materials to connect key components of the product, it is possible to better manage the increasing heat and protect sensitive equipment to meet 5G requirements, thereby helping to improve product performance. Through the case analysis of 5G network device thermal management solutions, it may help you solve the problem of high heat dissipation in the product design process.

02. Thermal management solution for a certain brand's dual band 1200M gigabit router

03. Thermal management solution for a certain brand's 2900M dual band intelligent wireless router

04. Analysis of Heat Dissipation Improvement Scheme for Hi Wifi Router

Defects of traditional heat dissipation mode:

1. Increasing the thickness of thermal conductive materials affects thermal efficiency;

2. Frequent conversion of multi-layer thermal conductive materials;

3. Multi channel SMT process and cumbersome operation procedures;

Advantages of the new heat dissipation solution:

1. Meet the requirements of product lightweight and reduce the thermal resistance of heat conduction channels;

2. Reduce hierarchical transitions and improve heat conduction efficiency;

3. Flexible and versatile appearance structure that meets product design concepts;

05. Heat dissipation improvement plan for a certain brand of router

Disadvantages of the old plan:

① Single heat source and single heat dissipation limit the overall thermal management efficiency of the product;

② To meet the distance between the heat source and the shell, resulting in a significant increase in thermal resistance;

③ PA adopts a single heat sink setting, which may reduce the signal strength of network devices;

Advantages of the new plan:

① Shorten the distance between the heat source and the heat dissipation shell to minimize the thermal resistance value;

② Block based heat dissipation design scheme, which can better meet the requirements of lightweight product design;

③ Improve solid work efficiency and enhance product signal strength;