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Industry news

High performance silicon free thermal conductive gasket

Time:2021-07-22Number:1401

We know that in thermal conductive materials, Thermal padMainly composite materials based on organic silicon materials, which are widely used. However, with the diversification of applications, a common risk of thermal conductivity gaskets in organic silicon systems is gradually being recognized, which is the problem of volatilization and oil leakage.

The hazards of low molecular weight volatilization and oil leakage of organosilicon

  • Security monitoring and camera equipment - volatile organic silicon components can condense on the mirror surface, contaminate the lens, and affect image clarity

  • Optical components - also affected by condensation affecting the transmittance of the device

  • Micro motor - causing corrosion of coil copper wire

  • Hard disk drive (HDD) - The leaked silicone oil adsorbs dust, causing damage to the read head, recording film, and inability to read and write data correctly.

  • Unpolymerized siloxanes and leaked siloxanes migrate to the circuit board over time, adsorbing dust and potentially causing short circuits.

  • Under extreme conditions, volatile siloxanes will form an insulating layer of silicon dioxide, causing contact failure.

Although material researchers have been working hard to control the volatility and oil leakage rates, the products on the market can only be described as low volatility and low oil leakage, and these two problems cannot be completely eliminated.
At this point, it is necessary to consider using silicon free thermal pads. Silicon free thermal pad is a thermal conductive material mainly composed of non silicone gel. This material has no small molecule siloxane volatilization, no silicone oil precipitation, and will not cause circuit faults. It can be applied in special fields sensitive to silicon.
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