What thermal conductive materials and heat sink components are more suitable for 5G mobile phone heat dissipation

The issue of heat dissipation has always been a difficult point of high concern in the consumer electronics industry. With the advent of the intelligent era, the demand for mobile phones is increasing, and the hardware configuration of mobile phones is also improving. The performance of mobile phone processors is improving every year, which inevitably brings about heating problems. In 5G smartphones, more antennas need to be added to receive signals, and high-speed network data transmission also increases the phone's heat generation. The mainstream material used in mobile phones now is glass, which has a significantly slower heat dissipation speed compared to metal materials. In addition, the internal component stacking of mobile phones is becoming more compact, which puts higher demands on the heat dissipation ability of mobile phones.

Mobile phone cooling technology can be divided into the following types:

1. Liquid cooling heat dissipation:

Mobile phone liquid cooling mainly uses heat pipes, which are essentially hollow closed pipes containing liquid. The liquid evaporates and absorbs heat in the evaporation section of the pipe, becoming gas that condenses into liquid and releases heat in the condensation section of the pipe. The advantages of liquid cooling heat dissipation are long service life and flexible settings. Liquid cooling heat dissipation can be placed in any position inside the phone that requires heat dissipation. At the same time, due to relatively mature technology, the cost is also relatively low.

2. Graphene heat dissipation:

This is a common heat dissipation method currently used, which belongs to the internal heat dissipation form of mobile phones and relies on the high thermal conductivity of graphene. Graphene material has high temperature resistance, good thermal conductivity, chemical stability, and is currently a cost-effective mobile phone heat dissipation material. The characteristics of graphene give it innate heat dissipation ability, with a heat dissipation coefficient 2-5 times that of copper, but its density is only 1/10~1/4 of copper, making it lighter in weight. At the same time, graphene is easy to process and can be customized in shape and size according to needs, with good plasticity and other advantages.

3. VC heating plate:

VC heat dissipation plate, also known as vacuum chamber heat dissipation plate technology, is a vacuum chamber with a fine structure on the inner wall, usually made of copper. When heat is conducted from the heat source to the VC chamber, the cooling liquid in the chamber begins to vaporize upon heating. The liquid vaporizes and absorbs heat, and the condensed cooling liquid returns to the evaporative heat source through microstructured capillary channels (the driving force of the entire cycle is capillary force). This process can be repeated continuously. The design of the heat dissipation plate varies with the size of different components, and the manufacturing process is relatively complex and costly. It is commonly used in flagship mobile phone products that require volume control and rapid heat dissipation.

4. High thermal conductivity material:

Selecting thermal interface materials with high thermal conductivity is mainly used to fill the micro gaps and uneven surface voids generated when two materials are bonded or in contact, establish effective thermal conduction channels between electronic components and heat sink components, significantly reduce thermal contact resistance, and improve device heat dissipation performance. For example, thermal conductive graphite material and thermal conductive silicone sheetThermal interface material