High temperature is the enemy of integrated circuits. High temperature not only leads to unstable equipment support and shortened service life, but also may cause certain components to burn out. Portable devices can also cause harm to the human body. The heat that causes high temperatures does not come from outside the electronic device, but from inside the electronic device or integrated circuit. The function of heat dissipation components is to absorb and dissipate this heat into or outside the device, ensuring the normal temperature of electronic components.
The mainstream 720P cameras are gradually moving towards high-definition pixels, 1080P, 4K image quality, etc., with high power consumption and heat generation, and in a sealed environment, higher requirements are placed on the overall heat dissipation scheme. The evaporation of thermal conductive material molecules and the oil release of silicone oil, as well as the phenomenon of silicon migration, will all have an impact on the optical lens. Therefore, there will be higher requirements for the oil separation and other aspects of thermal conductive interface materials.
The low temperature resistance of chips has become a bottleneck for heat dissipation. How to reduce the thermal resistance of the thermal interface is an important factor to consider in thermal design. High thermal conductivity materials provide a solution. Silicon free thermal conductive sheets are high-performance, compatible, silicone free, ROSH compliant, highly compressible, soft and elastic thermal interface materials, suitable for high demand monitoring camera heat dissipation.
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