In depth article - How to solve the heat dissipation and shielding problems of routers with thermal shielding materials

As a major component of network transmission, wireless routers generate a large amount of heat due to the need to provide strong network transmission speed. If the heat generated by the router is too high during operation, it will affect the wireless signal, such as unstable signal or network disconnection.
In order to solve the problems of router heat dissipation and stability, engineers usually use thermal conductive silicone film combined with the outer shell for heat dissipation during router thermal design. Generally, routers use passive heat dissipation, which means that heat is dissipated through body heat dissipation holes, heat dissipation fins near the motherboard, and heat dissipation pads. When choosing a heat dissipation gasket, we need to determine the size and thermal conductivity of the thermal conductive silicone film based on the specific heat source (such as CPU, memory).

Characteristics of Advanced Institute Thermal Conductive Silicone Sheet Products

1● Multiple thickness options are available. ●

2Equipped with self-adhesive without the need for additional surface adhesive. ●

3Good thermal conductivity: 1.5-13W/mK. ●

4● Compressible, soft, and elastic in low-pressure environments. ●

In addition to heat dissipation, there are also shielding problems in the main chip area of the router. On the shielding, a shielding cover is mainly added above the chip, and thermal conductive gel is generally added between the shielding cover and the chip to fill the gap.

Characteristics of thermal conductive gel products

1Low thermal impedance, long-term reliability. ●

2● Soft, with almost no pressure between the device ●

3Good thermal conductivity: 1.5-6.0W/mK. ●

4Can be easily used for automated operation of dispensing systems. ●