How to solve the heat dissipation problem of new electronic devices in the 5G era

Advanced Institute of Thermal Conductive MaterialsIt is a new type of industrial material designed to meet the thermal conductivity requirements of equipment. They have proper countermeasures for possible thermal conductivity problems and provide strong assistance for the high integration and ultra small and ultra-thin of equipment. Nowadays, thermal conductivity products have been increasingly applied to many products. In order to improve the reliability of products, for electronic devices, the higher the reliability, the longer the fault free working time, which can enhance product competitiveness and improve user experience.
     
Advanced thermal conductive materials are mainly used to solve the thermal management problems of electronic devices. The heat generated during operation will directly affect the performance and reliability of electronic products. Experiments have shown that for every 2 ℃ increase in temperature of electronic components, reliability decreases by 10%; The lifespan at a temperature rise of 50 ℃ is only 1/6 of that at a temperature rise of 25 ℃. As the volume of integrated circuit chips and electronic components continues to shrink, their power density is rapidly increasing, and heat dissipation has become an urgent problem that electronic devices need to solve.
Thermal conduction, convection, and radiation are the three basic ways of heat transfer. In the process of heat transfer, depending on the structure of the radiator, heat transfer is carried out through a combination of conduction, convection, and radiation. The principle of heat dissipation in electronic products is to transfer heat from the heat generating device to the heat sink through advanced thermal interface materials, and ultimately dissipate the heat to the external environment, thereby reducing the temperature of electronic products.
Thermal conductive materials are used between the contact interface of the heat source and the heat sink to improve the thermal conductivity efficiency and effectively solve the heat dissipation problem of the entire high-power electronic device. With the continuous advancement of science and technology, electronic device products are gradually showing two development trends: first, the integrated functions on a single device are gradually increasing and becoming more complex; The second is that the volume of the product itself gradually shrinks. Both of these changes have raised higher requirements for the thermal management technology of electronic devices, and have gradually increased the requirements for the thermal conductivity coefficient and thermal stability of thermal conductive materials during long-term operation. At present, the recommended thermal conductive materials for application by Zhaoke includeThermal conductive graphite materialHeat conduction room filling materials, heat conduction gel, heat conduction silicone grease, heat conduction phase change materials, etc.