Ultra high thermal conductivity TIM in the new era of 5G: application scenarios of carbon fiber thermal pads

1、 What is a thermal pad?

      Thermal padIt fills the air gap between the heating element and the heat sink or metal base, and their flexible and elastic characteristics make them suitable for covering very uneven surfaces. Heat is conducted from the separation device or the entire PCB to the metal casing or diffusion board, thereby improving the efficiency and service life of the heat generating electronic components. The thermal pad is installed between the heat dissipation cold plate and the heating chip, which conducts the heat generated by the chip to the heat dissipation cold plate, thereby reducing the temperature of the chip. When the thermal pad is compressed, it will generate compressive stress, which increases with the increase of compression amount. When selecting the thermal pad, it should be noted that the compressive stress during compression should not exceed the maximum required pressure of the heating chip, otherwise it will cause damage to the chip.

The commonly used thermal pads on the market are a mixture of organic silicon resin, thermal conductive particles, adhesives, and other substances. They can achieve low interfacial thermal resistance performance at relatively low pressures and are used between heating chips and cooling plates to effectively eliminate air, reduce contact thermal resistance, and improve heat dissipation. Thermal pads have a certain degree of elasticity and can fill different gaps.
  

2、 What is carbon fiber thermal pad?

In the era of 5G, the functional requirements for electronic products are becoming increasingly high, and more stringent requirements are also put forward for thermal conductivity and heat dissipation systems. Many manufacturers and material manufacturers are seeking materials with higher thermal conductivity,Carbon fiber thermal conductive sheetGradually developed and introduced into the market. Carbon fiber thermal conductive sheet is a type of thermal insulation sheet mainly filled with thermal conductive carbon fiber, used between heating components and heat sinks. By filling the gap between the two with air, the heat of electronic devices is accelerated, thereby ensuring the performance and lifespan of electronic products. Thermal conductive carbon fiber is a type of high thermal conductivity carbon fiber material, with a thermal conductivity coefficient in the fiber direction that can exceed that of copper. It also has good mechanical properties and excellent thermal conductivity and radiation heat dissipation capabilities. The fibrous high thermal conductivity carbon powder made from this carbon fiber itself is fibrous and can be designed with thermal conductivity orientation, which is the biggest difference and advantage from previous thermal conductivity materials.

3、 The difference between carbon fiber thermal pad and thermal silicone pad

Compared with the commonly used thermal conductive silicone gaskets in the market, carbon fiber thermal conductive gaskets have made significant breakthroughs in key parameters such as thermal resistance, thermal conductivity, ease of use, flame retardant rating, and gasket life, and are commonly used in the cooling system of portable electronic devices.Carbon fiber thermal padDue to its ultra-high thermal conductivity, light weight, corrosion resistance, high modulus, low density, oxidation resistance, high temperature resistance in non oxidizing environments, reusability, no silicone oil precipitation, dry and non sticky, and easy construction characteristics, it is suitable for various equipment components with high heat density and high dimensional accuracy requirements. It is an irreplaceable and important heat dissipation system component, which has a disruptive driving effect on reducing the production cost of cutting-edge equipment and promoting technological innovation of high-tech electronic products.

4、 Application Fields of Carbon Fiber Thermal Conductive Gaskets

·Aerospace, military, and automotive electronic cooling and heating components, such as electronic devices, semiconductor memory devices, etc;

·Universal frequency converters, medical equipment DSC；

·Automotive electronics, such as in car cameras, motor control units, car navigation, and car lighting (LED);

·Laser HUD light source;

·3C consumer goods and handheld electronic devices (such as mobile phones, tablets, computers, AR/VR, etc.);

·Base station, chassis, IGBT module.