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Current:Home >News >Industry news >New Product Release: Research Platinum S8 Thermal Conductive Gasket Advanced Institute (Shenzhen) Technology Co., Ltd
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Industry news

New Product Release: Research Platinum S8 Thermal Conductive Gasket Advanced Institute (Shenzhen) Technology Co., Ltd

Time:2021-05-24Number:1566

Advanced Institute (Shenzhen) Technology Co., LtdGraphite coated foam S8 thermal padThe traditional encapsulated compressible foam gasket design is used to achieve thermal conductivity performance. S8 combines the thermal conductivity of the outer coating material S8 synthetic graphite with the repeatable compression and rebound characteristics of the foam core material. S8 uses the Research Platinum series silicone foam, which can achieve UL V0 flame retardant rating.

Features and advantages


• High compression deformation

High heat transfer efficiency, especially suitable for large-sized gaps

• Repeatable compression and rebound

• Lightweight

Low interface pressure

• Surface wear resistance

Suitable for large-scale production

Multiple 5mm wide gaskets can be used to reduce overall thermal resistance

• High operating temperature and UL V0 flame retardant rating

value

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Provide a compressible thermal interface for sliding connections. It is an ideal choice for blade insertion applications.

• Ensure good contact of moving parts on the thermal interface, which is better than using traditional heat conduction mud, heat conduction gel or heat conduction paste

For pressure-sensitive devices, provide lower pressure than traditional thermal pads

Provide ideal thermal conductivity for large gaps

• Improve the reliability of electronic devices

Compliant with RoHS and Reach standards
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