Surface gold tin welding gold paste

Surface gold tin solder paste is a high-performance conductive material specifically designed for surface soldering of electronic components, consisting of high-purity gold powder, tin powder, adhesive, and solvent. This material has excellent conductivity and soldering performance, and is widely used in surface soldering processes for printed circuit boards (PCBs), integrated circuits (ICs), and other electronic components. By precise proportioning and strict production processes, the surface gold tin welding paste can ensure high reliability and stability of the welding points.

Product characteristics

1. High conductivity: The combination of gold and tin gives the solder paste excellent conductivity, ensuring low resistance at the solder joint.

2. Excellent weldability: The surface gold tin solder paste has good fluidity and wetting properties, making it easy to weld and form strong solder joints.

3. High adhesion: capable of forming uniform and dense conductive layers on various substrates, with strong adhesion.

4. Corrosion resistance: Gold has extremely high chemical stability, is not easily oxidized or corroded, and extends its service life.

5. Good operability: moderate viscosity, easy to print and apply, suitable for automated production lines.

Production process

1. Material ratio:
   • High purity gold powder: as the main conductive component.
   • High purity tin powder: enhances welding performance.
   • Adhesive: Improve the adhesion and stability of the slurry.
   • Solvent: Adjust the fluidity and curing speed of the slurry.
2. Mixing and stirring:
   • Use a high-speed mixer to mix the above materials evenly, ensuring that each component is fully dispersed.
3. Filtering and purification:
   • By finely filtering to remove impurities, the slurry is ensured to be pure and pollution-free.
4. Printing or coating:
   • Evenly print or apply the prepared surface gold tin solder paste onto the surface of the substrate.
   • Screen printing, spraying and other methods can be used to ensure uniform coverage.

5. Curing and drying:

   • Heat treatment is carried out through an oven or curing furnace to solidify the gold solder paste and form a conductive layer.

   • Accurate temperature and time control ensures optimal curing effect.
     

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