Filling gold paste

Hole filling gold paste is a conductive material used to fill through holes or blind holes in PCBs to enhance the electrical connection performance of circuit boards. This material is usually composed of gold powder, organic solvents, and binders, prepared through advanced processes, and widely used in the electronic manufacturing industry, especially in high-precision and high-performance circuit board manufacturing.


characteristic

1. High conductivity: The filling gold paste has excellent conductivity, which can ensure good electrical connections between layers in the circuit board.
2. Good weldability: After solidification, the gold paste material has a smooth and flat surface, making it easy to weld and improving welding reliability and consistency.
3. Corrosion resistance: Gold has extremely high chemical stability and can resist the corrosion of acidic and alkaline chemicals, extending the service life of circuit boards.
4. High reliability: The gold paste material, after precise proportioning and strict quality control, can maintain stable performance in various environments.
5. Easy to operate: The filling gold paste is easy to apply and cure, suitable for use in automated production lines.

Product advantages

1. Multifunctionality: Suitable for various types of PCBs, especially high-density interconnect (HDI) circuit boards and high-end electronic devices.
2. High reliability: It can maintain stable performance in various complex environments and has extremely high reliability.
3. Easy to process: Good flowability and curing performance, easy to fill and cure.

4. Environmental Protection: The production process is environmentally friendly and meets modern environmental standards.
   

workmanship

1. Formula design:
   • Gold powder: High purity gold powder is selected as the main conductive component.
   • Organic solvents: Add appropriate organic solvents to adjust the fluidity of the slurry.
   • Adhesive: Add an appropriate amount of adhesive to improve the adhesion and stability of the slurry.
2. Preparation process:
   • Mixing and stirring: Mix gold powder, organic solvent, and binder in a certain proportion and stir evenly.
   • Filtration: Fine filtration is used to remove impurities and ensure the purity of the slurry.
   • Uniform dispersion: Ultrasonic dispersion technology is used to evenly disperse the gold powder in the slurry.
3. Application process:
   • Coating: Apply the prepared filling gold paste evenly onto the through holes or blind holes of the circuit board.
   • Curing: Heat treatment is carried out in an oven or curing furnace to solidify the gold paste and form a conductive layer.
   • Testing: Use professional testing equipment to test the quality of filling holes to ensure reliable conductivity.

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