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Copper paste
Terminal electrode conductive copper paste
  • Terminal electrode conductive copper paste
  • Terminal electrode conductive copper paste
  • Terminal electrode conductive copper paste
  • Terminal electrode conductive copper paste
  • Terminal electrode conductive copper paste

Terminal electrode conductive copper paste

Advanced Institute Technology Terminal Electrode Conductive Copper Paste is a high-performance conductive material designed specifically for MLCC terminal electrodes. This product has good printing characteristics and adhesion, and can be accurately coated on the end electrode area to form a uniform and dense copper layer. Multiple models are available to meet the needs of MLCC of different sizes, effectively reducing the occurrence of pin holes at the end and improving product reliability.
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+86-13826586185

Terminal electrode conductive copper paste is a high-performance conductive material designed specifically for the preparation of terminal electrodes in multilayer ceramic capacitors (MLCC) and other electronic components. It uses high-purity copper powder as the main conductive component, combined with a specially designed resin matrix and functional additives, and is made through fine dispersion and grinding processes. This product has excellent conductivity, adhesion, high temperature resistance, and sintering stability, suitable for high-temperature sintering processes, ensuring that the end electrodes of electronic components have stable conductivity and good mechanical strength.
端电极导电铜浆

Product characteristics

  1. High conductivity:
    • High copper powder content and low resistivity ensure excellent conductivity of the end electrode.
    • Applicable to the requirements of high-frequency and high-power electronic components.
  2. Strong adhesion:
    • A strong bonding force is formed between the resin matrix and the ceramic or metal substrate, ensuring stable adhesion of the copper paste on the substrate.
    • Improve the reliability and stability of electronic component end electrodes.
  3. High temperature resistance:
    • High temperature sintered copper paste remains stable during the high-temperature sintering process and will not affect its conductivity and mechanical strength due to temperature changes.
    • Suitable for high-temperature sintering process, meeting the requirements of MLCC manufacturing and other high-temperature applications.
  4. Sintering stability:
    • It has excellent stability during the sintering process and will not have defects such as bubbles or cracks.
    • Ensure the conductivity and mechanical strength of the terminal electrode.
  5. Environmentally friendly and pollution-free:
    • The product meets environmental standards, and there is no harmful gas release during the production process, making it environmentally friendly.
    • Suitable for electronic component manufacturing that meets the requirements of green manufacturing and sustainable development.

铜浆
Product advantages

  1. Improving product quality:
    • High conductivity and strong adhesion ensure excellent electrical performance and mechanical stability of electronic component end electrodes.
    • Helps to improve the efficiency and reliability of electronic components.
  2. Improve production efficiency:
    • Good processing performance and sintering stability contribute to improving production efficiency and yield.
    • Reduce the scrap rate during the production process.
  3. Reduce costs:
    • Compared with traditional precious metal materials, copper paste has a cost advantage and helps reduce the production cost of electronic components.
    • Reduce the cost of electronic components.
  4. Meeting diverse needs:
    • End electrode conductive copper paste products can be customized according to different specifications and performance requirements of electronic components.
    • Meet the diverse needs of different application fields.

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