Non pressure sintered nano copper paste is an innovative high-performance conductive material, which uses nanoscale copper particles as the conductive main body, combined with advanced dispersion technology and specially formulated resin matrix. The biggest feature of this product is that it can achieve effective connection between nano copper particles without applying external pressure during the sintering process, forming a conductive layer with high conductivity, high thermal conductivity, and high strength. This characteristic makes it widely applicable in fields such as microelectronic packaging, flexible electronics, solar cells, and high-performance coatings.
Product characteristics
- Excellent conductivity:
- Nano copper particles have extremely high specific surface area and surface activity, which makes pressureless sintered nano copper paste exhibit excellent conductivity, effectively reducing electrical resistivity and improving electron transfer efficiency.
- Pressure free sintering ability:
- Through special preparation processes and formula design, nano copper particles can achieve low-temperature sintering under pressureless conditions, forming a dense conductive network. This feature simplifies the production process and reduces production costs.
- Good dispersion stability:
- Nano copper particles are uniformly dispersed in the slurry, avoiding agglomeration and ensuring the stability of the slurry during long-term storage and use.
- Adjustable viscosity and flowability:
- The viscosity and flowability of pressureless sintered nano copper paste can be adjusted according to specific needs, facilitating precise control of coating thickness and shape in microfabrication and improving production efficiency.
- Environmental friendliness:
- Compared to traditional conductive materials, pressureless sintered nano copper paste has less environmental impact during preparation and use, which meets the requirements of green and sustainable development.
application area
- Microelectronics packaging:
- Non pressure sintered nano copper paste is widely used in the field of microelectronic packaging, such as chip interconnection and wire bonding, due to its excellent conductivity and good processing performance, effectively improving the integration and reliability of electronic products.
- Flexible Electronics:
- In the field of flexible electronics, pressureless sintered nano copper paste has become a key material for the preparation of wearable devices, flexible display screens, etc. due to its bendable and non breakable characteristics, promoting the rapid development of flexible electronics technology.
- Solar cell:
- As a conductive material for solar panel electrodes, pressureless sintered nano copper paste can significantly improve photoelectric conversion efficiency, reduce production costs, and is of great significance for promoting the upgrading of the solar energy industry.
- High performance coatings:
- In the field of high-performance coatings, the application of pressureless sintered nano copper paste can improve the conductivity, thermal conductivity, and antibacterial properties of coatings, meeting the needs of specific fields.
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