Low temperature conductive copper paste

Low temperature conductive copper paste is a high-performance conductive material designed specifically for low-temperature curing processes. It is made by combining high-purity copper powder with a specially designed resin matrix, using advanced stirring and dispersion techniques. This product has excellent conductivity, adhesion, processability, and low-temperature curing characteristics, and is widely used in electronic packaging Manufacturing of conductive connections and resistors in fields such as PCB circuit boards, automotive electronics, and industrial control equipment.

Product characteristics

1. High conductivity:
   • Copper powder has a high content and low resistivity, ensuring excellent conductivity even under low-temperature curing conditions.
   • Suitable for various conductive connections and resistor manufacturing, meeting different application requirements.
2. Strong adhesion:
   • A strong bonding force is formed between the resin matrix and the substrate, ensuring stable adhesion of the copper paste on the substrate and preventing it from falling off easily.
   • Suitable for different substrates such as PCB boards, ceramic substrates, metal substrates, etc., to improve product reliability and stability.
3. Excellent processability:
   • It has good fluidity and thixotropy, suitable for various processing techniques such as screen printing, spraying, and dispensing, and is easy to operate and control.
   • It can be made into conductive structures of different shapes and sizes to meet diverse needs.
4. Low temperature curing characteristics:
   • It can be cured under low temperature conditions, reducing the curing temperature, energy consumption, and processing costs.
   • Suitable for applications with special requirements for low-temperature curing, such as microelectronic packaging and thin PCBs.
5. Environmentally friendly and pollution-free:
   • The product meets environmental standards and does not release harmful gases during use, making it environmentally friendly.
   • Suitable for electronic component manufacturing that meets the requirements of green manufacturing and sustainable development.

Product advantages

1. Improve conductivity:
   • High conductivity and strong adhesion ensure stable conductivity and good temperature coefficient of conductive connections and resistors, improving product reliability and consistency.
2. Improve production efficiency:
   • Excellent processing performance facilitates large-scale production and automated manufacturing, improving production efficiency and yield.
3. Reduce costs:
   • The use of high-purity copper powder and specially designed resin matrix has a cost advantage, which helps to reduce the manufacturing cost of conductive connections and resistors.
4. Enhance product reliability:
   • The low-temperature curing characteristic ensures that the product can achieve stable conductivity under low temperature conditions, improving the reliability and durability of product use.

application area

1. Electronic packaging:
   • Used for conductive connections in microelectronic packaging, such as chip bumps, solder pads, etc.
   • Suitable for low-temperature curing conductive connections in microelectronics fields such as semiconductor devices and IC packaging.
2. PCB circuit board:
   • Used for conductive connections and resistor manufacturing on PCB circuit boards, providing stable conductivity and adhesion.
   • Suitable for computer motherboards, mobile phone circuit boards, automotive electronic PCB boards, etc.
3. Automotive Electronics:
   • Used for the manufacturing of conductive connections and resistors in automotive electronic products, such as car audio systems, car control systems, etc.
   • Suitable for stable conductivity and reliable connection in high temperature and vibration environments.
4. Industrial control:
   • Used for the manufacturing of conductive connections and resistors in industrial control equipment and instruments, providing stable conductivity and heat resistance.
   • Suitable for electronic component manufacturing in industrial automation, power electronics, medical equipment and other fields.

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