Low temperature sintering soldering copper paste

Low temperature sintered solder copper paste is a special solder material commonly used to achieve metal to metal welding at lower temperatures. This type of material combines the characteristics of solder (Sn) and copper (Cu), and achieves welding through low-temperature sintering technology, thereby reducing thermal stress on the substrate, making it suitable for temperature sensitive electronic components and substrates.

Characteristics and advantages

Low temperature sintered solder copper paste has the following characteristics and advantages:

• Low temperature welding: The welding process can be completed at a lower temperature, reducing the risk of thermal damage to the substrate.
• High reliability: By sintering to form strong intermetallic compounds (IMCs), the mechanical strength and conductivity of the welding point are improved.
• Workability: Usually in the form of a paste or paste, it can be applied to substrates through methods such as glue dispensing and screen printing.
• Suitable for sensitive materials: particularly suitable for temperature sensitive semiconductor devices, ceramic substrates, and other materials.

composition and structure

Low temperature sintered solder copper paste usually contains the following components:

• Solder (Sn): As the main soldering material, it provides good conductivity and mechanical properties.
• Copper (Cu): Used to enhance the strength and fatigue resistance of solder.
• Sintering aids: such as nanoparticles, organic additives, etc., help promote the sintering process of Sn Cu alloys at lower temperatures.
• Carrier: usually an organic solvent or polymer, used to maintain the fluidity of the material and evaporate it before sintering.

Preparation Method

Low temperature sintered solder copper paste can be prepared by the following steps:

1. Ingredients: Mix solder powder, copper powder, and other additives in a certain proportion.
2. Mixing: Use a blender to evenly mix the above ingredients to form a uniform slurry.
3. Dispersion: By ultrasonic dispersion or other means, ensure that the particles are evenly dispersed without agglomeration.
4. Preparation of carrier: Add appropriate carrier materials to give the slurry good fluidity and thixotropy.
5. Packaging: Encapsulate the prepared slurry in a sealed container for storage and transportation.

Application scenarios

Low temperature sintered solder copper paste is widely used in applications that require reliable soldering at lower temperatures, including but not limited to:

• Semiconductor packaging: Used in the packaging process of semiconductor chips to connect the chip to the substrate and reduce thermal damage.
• Microelectronics assembly: Used for soldering sensitive electronic components in the assembly of microelectronic devices.
• Solar panels: Used in the manufacturing process of solar panels to weld solar cells and improve efficiency.
• LED lighting: used in the manufacturing of LED lamps for soldering LED chips and other components.

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