PI copper and silver plated film

PI copper and silver plated film is a high-performance composite material that deposits copper and silver onto a PI thin film. The appearance is smooth and even, with a uniform coating. It combines the high temperature resistance and high strength characteristics of PI with the excellent conductivity and thermal conductivity of copper and silver. Widely used in fields such as electronics and communication, effectively improving equipment performance, exquisite craftsmanship, and reliable quality.

Product characteristics

1. Excellent high and low temperature resistance: PI film itself has excellent high and low temperature resistance, with a wide working temperature range, and can be stably used in the temperature range of -200 ° C to 300 ° C (some products can even reach -269 ° C to 400 ° C). After copper or silver plating, this characteristic is preserved, making the product suitable for applications in extreme environments.

2. Excellent conductivity: Copper and silver are both excellent conductors, and after coating on the surface of PI film, the conductivity of the material can be significantly improved. This is particularly important for electronic devices that require efficient current transmission.

3. Good electromagnetic shielding performance: The silver layer can form an effective shielding layer in high-frequency electromagnetic fields, preventing the propagation of interference signals and external electromagnetic radiation interference, thereby improving the stability and reliability of the equipment.

4. Excellent chemical stability: PI film has the ability to resist corrosion and chemical erosion. After copper or silver plating, this characteristic is further enhanced, allowing the product to remain stable in harsh chemical environments.

5. Excellent mechanical and insulation properties: PI film itself has high tensile strength and wear resistance, and can withstand large mechanical stresses without easily breaking. At the same time, it also has good insulation performance, which can effectively isolate current and prevent the occurrence of circuit short circuits and leakage phenomena. After copper or silver plating, these properties are preserved to a certain extent.

Production process

1. Pre treatment of PI film: Surface cleaning, roughening and other treatments are carried out on the PI film to improve the adhesion of the coating.

2. Coating deposition: Copper and silver layers are deposited on the surface of PI film using methods such as electroplating, chemical plating, or vacuum coating. This step requires precise control of the thickness and uniformity of the coating.

3. Post treatment: Clean and dry the coating to obtain the final product.

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