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Conductive silver copper adhesive is a type of bonding material with specific conductive properties. It combines the conductive characteristics of silver and copper, and through the bonding effect of the matrix resin, conductive particles (such as silver, copper, etc.) are bonded together to form a conductive path, achieving conductive connection of the bonded material. Conductive silver copper adhesive has a wide range of applications in various fields, including microelectronics assembly, electronic and electrical equipment, communication equipment, aerospace, etc.
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Conductive silver copper adhesive is a high-performance conductive adhesive that combines the advantages of silver and copper metals. Through the adhesive effect of the resin matrix, conductive particles (silver powder and copper powder) are tightly bonded together to form a stable conductive path. This conductive adhesive not only has the high conductivity of silver, but also has the cost advantage of copper, making it widely used in fields such as electronics, optoelectronics, and communication.
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