Pressure sintered silver paste

Basic characteristics

1. Paste state: The pressure sintered silver paste maintains its paste state at room temperature, making it easy to apply or glue. This characteristic makes it easy to operate in various precision machining processes and can meet the coating requirements of complex circuits and small components.

2. Sintering performance: Under certain temperature and pressure, the silver powder particles in the pressure sintered silver paste will undergo sintering, forming a highly conductive and high-strength metal connection layer. This sintering process ensures the stability and reliability of the connection, making it suitable for precision fields such as high integration chip packaging.

3. Conductivity: Due to the presence of high-purity silver powder, pressure sintered silver paste has excellent conductivity. This enables it to provide an efficient current transmission path in electronic packaging and circuit interconnection, ensuring the stability and efficiency of the circuit.
   

technological process

1. Preparation of Silver Paste: Firstly, prepare a paste like substance containing silver particles, which usually have a certain particle size distribution to ensure good connections can be formed during the sintering process.
2. Applying pressure: Applying appropriate pressure is a crucial step in the sintering process. Pressure helps to make the contact between silver particles tighter, thereby promoting the formation of sintering necks.
3. Heating sintering: At a certain temperature (usually higher than the melting point of silver but lower than the melting point of other materials), silver particles begin to sinter. Silver atoms migrate to the sintering neck region through diffusion, causing the sintering neck to gradually grow and the distance between adjacent silver particles to gradually decrease.
4. Pore variation: As the sintering process progresses, the pore network gradually changes. The initially formed pores gradually become smaller until a dense metal structure is finally formed.

sintering mechanism

• Formation of sintering neck: In the early stage of sintering, silver particles form a sintering neck through contact, and silver atoms diffuse and migrate to the sintering neck area, causing the sintering neck to continuously grow.
• Pore variation: As the sintering process progresses, the pores gradually decrease and eventually reach a dense state. Most of the holes are completely divided, with small holes gradually disappearing and large holes gradually becoming smaller until the final density is reached.
• Density and strength increase: During the sintering process, the contact area between silver particles continuously increases, and the pores gradually decrease, resulting in a significant increase in the density and strength of the sintered material.

application area

1. Microelectronics packaging: Pressure sintered silver paste is widely used in the field of microelectronics packaging and is an important material for achieving fine circuit interconnection. It can provide high conductivity and high-strength connections, ensuring the stability and reliability of the circuit. In integrated circuit (IC) packaging, pressure sintered silver paste plays a crucial role.

2. Flexible electronics: Due to its excellent flexibility and deformability, pressure sintered silver paste has become an indispensable connecting material in flexible electronic devices such as wearable devices and smart skins. It can maintain stable electrical connections under complex deformations such as bending and folding, meeting the special requirements of flexible electronic devices.

3. Other fields: In addition to microelectronic packaging and flexible electronics, pressure sintered silver paste can also be used in other fields that require high conductivity and strength, such as power semiconductor packaging, high thermal conductivity circuit fabrication, etc. In addition, in three-dimensional integrated circuit (3D IC) packaging, pressure sintered silver paste significantly improves packaging density and performance through multi-layer stacking and vertical interconnection.
   

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