Pressureless sintered silver paste

Basic characteristics

1. Paste state: The pressureless sintered silver paste maintains its paste state at room temperature, making it easy to apply or glue, making it easy to operate in various fine processing processes.

2. Sintering characteristics: Unlike pressure sintered silver paste, pressureless sintered silver paste can complete the sintering process at normal pressure and low temperature. This feature enables efficient sintering connections without adding additional pressure equipment, reducing production costs and complexity.

3. Conductivity and thermal conductivity: pressureless sintered silver paste has high conductivity and thermal conductivity, which gives it significant advantages in the fields of electronic packaging and thermal conductivity. It can provide an efficient current transmission path and ensure the stable operation of electronic devices.

4. Environmental friendliness: Non pressure sintered silver paste usually does not contain harmful substances such as lead, meets environmental requirements, and is suitable for electronic product manufacturing processes that have strict environmental requirements.
   

Preparation process

1. Preparation of silver powder
   • Silver powder is usually prepared by chemical reduction or physical vapor deposition methods. Chemical reduction method is a chemical reaction that reduces silver salts to silver powder. This method can adjust the particle size and shape of silver powder by controlling the reaction conditions. The physical vapor deposition method is to evaporate silver at high temperature and then deposit it to form silver powder, which can obtain high-purity and uniformly sized silver powder.
2. Silver paste blending
   • Mix the prepared silver powder with organic additives in a certain proportion. The determination of this ratio needs to take into account the final performance requirements of the silver paste, such as viscosity, sintering temperature, etc. During the blending process, specialized equipment is required for thorough mixing and blending to ensure even distribution of silver powder and additives, resulting in a stable silver paste.

application area

1. Semiconductor packaging: pressureless sintered silver paste has a wide range of applications in the field of semiconductor packaging, especially in the packaging of high-power semiconductor devices. It can provide stable and reliable electrical connections, ensuring the performance and lifespan of semiconductor devices.

2. Automotive Electronics: With the continuous improvement of automotive electronics, the application of pressureless sintered silver paste in the field of automotive electronics is becoming increasingly widespread. It can be used for packaging and connecting components such as automotive sensors and actuators, improving the reliability and durability of automotive electronic systems.

3. Aerospace: In the field of aerospace, there are extremely high requirements for the performance and reliability of electronic equipment. Pressure free sintered silver paste has become an ideal choice for packaging and connecting aerospace electronic equipment due to its excellent conductivity, thermal conductivity, and reliability.

4. Other fields: In addition, pressureless sintered silver paste can also be used in LED packaging, solar cell manufacturing, RF power equipment connection and packaging, providing efficient and reliable electrical connection solutions.
   

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