Continuous research and innovation direction of low-temperature conductive silver paste: exploration to enhance competitiveness

Brief introduction

Low temperature conductive silver paste plays a crucial role in the field of electronic manufacturing, especially in temperature sensitive applications such as flexible electronics and touch screens. With the continuous development of the electronics industry, continuous research and innovation of low-temperature conductive silver paste to enhance its competitiveness has become a focus of industry attention. This article will explore the continuous research and innovation directions of low-temperature conductive silver paste, and introduce the advanced technology of Advanced Institute (Shenzhen) Technology Co., LtdResearch Platinum Brand YB8601 Low Temperature Conductive Silver PastePerformance in these innovative directions.

2、 The current situation of low-temperature conductive silver paste

At present, low-temperature conductive silver paste has been applied in multiple fields, but still faces some challenges. For example, in some application scenarios, its conductivity performance cannot fully meet high-end requirementsHigh temperature sintered conductive silver pasteCompared to others, there may be a 10-20% difference in conductivity. Meanwhile, in terms of cost, due to limitations in raw materials and preparation processes, its cost is relatively high, which to some extent limits its large-scale application.

3、 Continuous research and innovation direction

（1） Silver powder optimization

1. Particle size and shape control
   • The particle size and shape of silver powder have a significant impact on the performance of low-temperature conductive silver paste. Research has shown that by precisely controlling the particle size of silver powder between 1-5 μ m and using a reasonable mixture of flake silver powder and spherical silver powder (such as flake silver powder accounting for 30% -50%), the bulk density of silver powder can be increased, thereby improving the conductivity of conductive silver paste.
   • Advanced Institute (Shenzhen) Technology Co., Ltd. has made progress in optimizing silver powder with its YB8601 low-temperature conductive silver paste. It adopts a special preparation process to control the average particle size of silver powder at around 3 μ m, with flake silver powder accounting for about 40%, which increases the conductivity of the conductive silver paste by about 15% compared to traditional low-temperature conductive silver paste.
2. Silver powder purity improvement
   • Improving the purity of silver powder can reduce the impact of impurities on its conductivity.High purity silver powder(such as purity above 99.99%) can significantly improve the conductivity of conductive silver paste. For every 0.1% increase in silver powder purity, the resistivity of conductive silver paste can be reduced by about 5% -8%.

（2） Improvement of Adhesive System

1. Development of new adhesives
   • Developing adhesives with lower curing temperatures, higher bonding strength, and better flexibility is an important direction. Traditional adhesives such as polyurethane and epoxy resin have limitations in certain properties. For example, some new organic-inorganic hybrid adhesives can provide bonding strength that is 20% -30% higher than traditional adhesives at curing temperatures of 80-120 ℃.
   • The YB8601 low-temperature conductive silver paste from Yanbo brand adopts a self-developed new adhesive system, with a curing temperature as low as 85 ℃, which is about 10-15 ℃ lower than similar products. At the same time, the bonding strength is increased by about 25%. This makes the conductive silver paste perform well in applications such as flexible circuit boards that require high temperature and bonding performance.
2. Optimization of the Interface between Adhesive and Silver Powder
   • Improving the interfacial adhesion between the binder and silver powder can enhanceConductive silver pasteOverall performance. Through surface modification techniques, such as coupling agent treatment of silver powder, the interfacial bonding force between silver powder and binder can be increased by 30% -50%, thereby improving the conductivity and mechanical properties of conductive silver paste.

（3） Additive Innovation

1. Dispersant optimization
   • Optimizing dispersants can make silver powder more evenly dispersed in the binder system. Efficient dispersants can reduce the agglomeration of silver powder by 30% -40%, thereby improving the conductivity of conductive silver paste. For example, some special structured polymer dispersants can make the dispersed particle size of silver powder smaller and the distribution narrower, thereby improving the performance of conductive silver paste.
2. Antioxidant addition
   • existLow temperature conductive silver pasteAdding antioxidants can improve its antioxidant properties and extend its service life. Experimental data shows that adding an appropriate amount of antioxidants (such as antioxidant content of 0.5% -1%) can reduce the oxidation rate of conductive silver paste by 50% -60% in high temperature and high humidity environments (such as temperature of 85 ℃, humidity of 85% RH).

（4） Innovation in preparation process

1. Application of Nanotechnology
   • The use of nanotechnology to prepare low-temperature conductive silver paste can accurately control the particle size and distribution of silver powder and other components. The application of nano silver powder (particle size less than 100nm) can improve the conductivity of conductive silver paste. Research has found that when the content of nano silver powder is between 5% and 10%, the conductivity of conductive silver paste can be increased by 20% to 30%.
   • Research Platinum Brand YB8601 Low Temperature Conductive Silver PastePartial use of nano silver powder technology, through precise proportioning and process control, improves the conductivity of conductive silver paste while ensuring overall performance.
2. Green preparation process
   • Developing green, environmentally friendly, and efficient preparation processes is the future development trend. The traditional preparation process may generate a large amount of organic solvent exhaust gas and waste residue. The preparation process using water-based systems can reduce the use of organic solvents by 80% -90%, reduce environmental pollution, and lower production costs.

4、 Conclusion

The continuous research and innovation of low-temperature conductive silver paste is crucial for enhancing its competitiveness in the field of electronic manufacturing. Through efforts in optimizing silver powder, improving binder systems, innovating additives, and innovating preparation processes, the performance of low-temperature conductive silver paste can be continuously improved, costs can be reduced, and its application scope can be expanded. The exploration and practice of the research platinum brand YB8601 low-temperature conductive silver paste by Advanced Institute (Shenzhen) Technology Co., Ltd. in these innovative directions provide useful references and inspirations for the development of low-temperature conductive silver paste.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.