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Low temperature conductive silver adhesive is an adhesive with certain conductivity properties after curing or drying, widely used in the packaging and bonding of electronic components and assemblies such as liquid crystal displays (LCDs), light emitting diodes (LEDs), integrated circuit (IC) chips, printed circuit board assemblies (PCBA), etc.Research Platinum Brand YB6016 Low Temperature Conductive Silver AdhesiveAs a leader among them, it has attracted widespread attention in the industry due to its high conductivity, good adhesion performance, and low-temperature rapid curing characteristics. However, in electronic devices, the service life of low-temperature conductive silver paste is directly related to the reliability and stability of the product. Therefore, conducting in-depth research on its service life has important practical significance.
Yanbo brand YB6016 low-temperature conductive silver paste is mainly composed of silver powder, resin matrix, curing agent, and other additives. It has the characteristics of high shear strength and low modulus, and has good adhesion to metals, ceramic substrates, silicon chips, green oil, etc. At the same time, the adhesive has excellent storage stability, low curing temperature, good electrical and mechanical properties of the cured material, and resistance to moisture and heat. Experimental data shows that,Research Platinum Brand YB6016Bake at 80 ° C for 36 minutes to fully cure. The volume resistivity after curing is less than 0.0008 Ω· cm, the shear strength is greater than 24Kg/die, the tensile strength is greater than 2500 psi, and the thermal conductivity reaches 6.5 W/mK, demonstrating excellent comprehensive performance.
Advanced Institute (Shenzhen) Technology Co., LtdHas rich experience in the field of electronic device packaging and bonding. The company has successfully applied the research platinum brand YB6016 low-temperature conductive silver adhesive in multiple projects and achieved good results. For example, in the motherboard packaging of a certain smartphone, low-temperature conductive silver glue is used to bond the chip to the substrate. After long-term use and testing, the motherboard of the phone has shown excellent stability and reliability, and there has been no significant decrease in the conductivity and adhesion performance of the low-temperature conductive silver adhesive.
The service life of low-temperature conductive silver paste in electronic devices is affected by various factors, including working environment temperature, humidity, and stress. By selecting appropriate curing conditions, optimizing the working environment, and improving the quality of the bonding interface, the service life of low-temperature conductive silver adhesive can be effectively extended. YB6016 low-temperature conductive silver adhesive from Yanbo brand has shown broad application prospects in the field of electronic device packaging and bonding due to its excellent performance and stability. In the future, with the continuous development of electronic technology, the performance and service life of low-temperature conductive silver paste will be further improved, providing better guarantees for the reliability and stability of electronic devices.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.
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