PI tin plated conductive film is a highly transparent and conductive polyimide film

PI tin plated conductive film

PI tin plated conductive film is a highly transparent and conductive polyimide film mainly used in the field of photolithography. It is a transparent film that can be used as a photolithography film; It has high conductivity and can be adjusted by the thickness of the conductive film to achieve good conductivity; PI tin plated conductive film can also be directly coated on the surface to be processed through chemical methods, providing reliable coating protection.

PI tin plated conductive film has good transparency, conductivity, and anti reflection ability, and can form composite films with other materials. Compared with ordinary optically transparent plastics, it can provide higher light transmittance and better color stability. At the same time, PI tin plated conductive film also has good thermal and chemical stability, and can be used for multi-layer structures.

    PI tin plated conductive filmWidely used in photolithography, metal etching, optical thin films, sensors and other fields. Can be applied to the PCB and LED display industry.

brief introduction

    PI tin plated conductive filmIt is a highly transparent and conductive polyimide film with high transparency and surface resistance of up to 100-1000 Ω/cm. The conductivity can also be adjusted by thickness. PI tin plated conductive film has good transparency, conductivity, and anti reflection ability; Additionally, it can be directly coated onto the surface to be processed through chemical methods to provide reliable coating protection; PI tin plated conductive film also has good thermal and chemical stability, and can be used for multi-layer structures.

PI tin plated conductive film can be used in practical applications in optical thin films, sensors, display panels, and other fields. It has the characteristics of high transparency, low surface resistance, strong anti reflection ability, and does not affect optical performance.

consist of

The PI tin plated conductive film is composed of 2,4,6-triisocyanate and p-phenylenediamine copolymer. Among them, the monomers generated by the reaction of diisocyanates with p-phenylenediamine are called low molecular weight polyimides (LCP), which are key materials for preparing PI tin plated conductive films.

Compared with LCP, diisocyanate based end groups have better thermal stability and do not contain p-phenylenediamine. However, low molecular weight polyimides can form hydrogen bonds with benzene rings or other side chains. Therefore, triisocyanates can form hydrogen bonds with these side chains and react with the free amino groups in the PI film, resulting in better conductivity of the PI tin plated conductive film.

The heat resistance of PI tin plated conductive film is determined by its three crystallization parameters, namely crystallinity and crystal index.

application

This material can be directly coated on the surface to be processed, providing reliable coating protection. PI tin plated conductive film also has good thermal and chemical stability, and can be used as a basic material for multi-layer structures, providing reliable coating protection for it; Due to its excellent transparency and anti reflection ability, it can be used as an optical thin film material; Its excellent conductivity can also be used as a sensor material.

TECHNICAL INDEX

1. Transmittance: ≥ 90%

2. Weather resistance: 25 ℃ (250h), 20 ℃ (500h), room temperature (90 ℃), 180 ℃ (1 day)

3. Stability: ≥ 50%

4. Conductivity: 10-50 Ω/m

5. Temperature coefficient: ≤ 25 ppm/℃

6. Film thickness accuracy: ± 1 μ m

7. Application scope: Photolithography/Electronics LED devices, touch screens, and other fields. Suitable for the post-processing of electronic products, such as surface processing of thin film substrates. It can also be used in the post-processing of flexible display screens, such as touch screens, flexible printed circuit boards, etc.

8. Product application: It plays an important role in surface processing of printed circuit boards (PCBs), thin film circuit boards (FPCs), flexible printed circuit boards (FPCs), and electronic products. This product can be used for multi-layer structures and has a wide range of application fields.