Detailed Introduction to the Preparation, Properties, and Applications of Ultra Micro porous Copper Foil

    Ultra microporous copper foilIt is a high-precision and high-performance conductive material with high conductivity, thermal conductivity, processability, and corrosion resistance. Its name comes from the tiny pore structures on its surface, which are at the nanometer or submicron scale. This article will provide a detailed introduction to the preparation, properties, and applications of ultra microporous copper foil.

1、 The preparation methods of ultra microporous copper foil mainly include photolithography, electrochemical method, lithography method, chemical etching method, etc. Among them, electrochemical method and chemical etching method are currently the most widely used methods.

Electrochemical method is the use of electrochemical reactions to process the surface of copper foil, forming tiny pores. The preparation process mainly includes the following steps:
(1) Preparation of substrate: Select high-purity copper foil as the substrate, clean it thoroughly, and perform surface treatment.

(2) Polarization treatment: Copper foil is used as the anode and placed in an electrolytic cell. Through polarization treatment, a layer of copper oxide film is formed on the surface of the copper foil.

(3) Electrolytic corrosion: Place the treated copper foil in an electrolyte containing fluoride, and control the current density and electrolysis time to achieve surface corrosion of the copper foilCopper oxide filmLocalized detachment, forming tiny holes.

(4) Cleaning and drying: Clean and dry the corroded copper foil to make its surface clean and free of impurities.

Chemical etching method is the use of chemical reactions to process the surface of copper foil, forming tiny pores. The preparation process mainly includes the following steps:

(1) Preparation of substrate: Select high-purity copper foil as the substrate, clean it thoroughly, and perform surface treatment.

(2) Coating photoresist: Coating photoresist on the surface of copper foil and creating the desired micro hole pattern through photolithography technology.

(3) Chemical etching: willCoating photoresistThe copper foil is then placed in a solution containing a chemical etchant. By controlling the etching time and temperature, the chemical etchant on the surface of the copper foil is partially etched away, forming tiny holes.

(4) Remove photoresist: Remove the photoresist from the corroded copper foil to make its surface clean and free of impurities.

2、 Performance characteristics: Ultra microporous copper foil has the following performance characteristics:

1. high conductivityUltra microporous copper foilThe pore structure can increase its surface area, enhance the contact between electrons and materials, and thus increase conductivity.

2. The pore structure of high thermal conductivity ultra microporous copper foil can increase its surface area, enhance the contact between heat and material, and thus increase thermal conductivity.

3. Machinability: Due to the micro porous structure of ultra microporous copper foil, it can be used for microfabrication and the manufacturing of microelectronic devices.

4. Corrosion resistant ultra microporous copper foil has good corrosion resistance and can be used in harsh environments.
   

3、 The application fields of ultra microporous copper foil are very extensive, mainly including the following aspects:

1. Ultra porous copper foil for electronic device manufacturing can be used to manufacture micro circuit boards, MEMS devices, fiber optic connectors, LEDs, and other microelectronic devices.

2. Due to the excellent thermal conductivity of ultra microporous copper foil, high-efficiency heat sinks can be manufactured.

3. Ultra microporous copper foil can be used in the manufacturing of aerospace devices such as satellites and solar panels.

4. Biomedical fieldUltra microporous copper foilIt can be used to manufacture devices in the biomedical field such as micro biosensors and microfluidic chips. In summary, as a high-precision and high-performance conductive material, ultra microporous copper foil has many excellent performance characteristics and is widely used in fields such as electronic device manufacturing, efficient heat sinks, aerospace, and biomedical fields.