The relationship between mechanical strength of sintered layer and additives in low-temperature sintered copper paste

introduction

Low temperature sintered copper pasteIt is a key material used in fields such as printed circuit board manufacturing and semiconductor packaging. It can form a metal layer with excellent conductivity at relatively low temperature conditions while maintaining good mechanical properties. The selection and proportion adjustment of additives have a crucial impact on the quality of the final product, especially on the mechanical strength of the sintered layer.

Additives in low-temperature sintered copper paste

Additives play an indispensable role in low-temperature sintered copper paste, as they can improve the bonding strength between copper powder particles, increase sintering efficiency, enhance the density of the sintered layer, and endow the material with specific functional properties. Common additives include but are not limited to:

• Adhesive: Helps maintain the morphological stability of copper powder before sintering.
• Dispersant: prevents copper powder from aggregating and ensures uniform distribution.
• Surfactant: reduces interfacial tension and promotes wetting between copper powder and substrate.
• Antioxidants: Protect copper powder from oxidation during sintering process.
• Other functional additives: such as substances that improve corrosion resistance or regulate sintering temperature.

Characteristics of YB5111 low-temperature sintered copper paste from Yanbo brand

The YB5111 low-temperature sintered copper paste produced by Advanced Institute (Shenzhen) Technology Co., Ltd. is a product specifically designed to meet the strict requirements of the modern electronics industry. Its characteristics are as follows:

• Low sintering temperature: The sintering process can be completed below 300 ° C, suitable for various substrate materials without damaging their original characteristics.
• High conductivity: Optimized formula ensures excellent electrical performance.
• Excellent mechanical strength: By carefully selecting additives, a high-strength sintered layer is achieved, which can remain stable even in complex stress environments.
• Environmentally friendly: Adopting lead-free and halogen-free formula, in compliance with RoHS directive and other international environmental standards.
• Easy to process: It has good printing adaptability and is easy to handle after curing, simplifying the production process.

The influence of additives on the mechanical strength of sintered layers

Enhancement of interparticle binding force

Appropriate additives can enhance the physical and chemical interactions between copper powder particles, thereby improving the overall structural stability of the sintered layer. For example, certain organic polymers can decompose into carbonaceous residues during the sintering process, which fill the gaps between particles, increasing the contact area and strengthening the connection points.

Increase in density

By adding an appropriate amount of flux or other components, the porosity inside the sintered body can be effectively reduced, thereby improving the density of the sintered layer. This not only helps improve the conductivity, but also directly enhances the compressive strength and other mechanical properties of the material.

Improvement of antioxidant performance

During the sintering process, copper is prone to oxidation reactions, leading to a decrease in conductivity and mechanical strength. The use of effective antioxidants can inhibit this process and ensure that the final sintered layer has long-lasting and stable performance.

conclusion

In summary, additives play a crucial role in low-temperature sintered copper paste. They not only affect the sintering process itself, but also determine the final mechanical strength and other key performance indicators of the sintered layer. Advanced Institute (Shenzhen) Technology Co., Ltd.'s YB5111 low-temperature sintered copper paste, with its unique formula design, has become an ideal choice for many electronic product manufacturers, ensuring high performance while balancing cost-effectiveness and environmental requirements. In the future, with the advancement of technology, it is expected that more innovative additives will be developed to further optimize the low-temperature sintering copper paste and its application effects.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.