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Beryllium copper is a supersaturated solid solution copper based alloy, which is a non-ferrous alloy with good mechanical, physical, chemical, and corrosion resistance properties. After solid solution and aging treatment, it has high strength limit, elastic limit, yield limit, and fatigue limit equivalent to special steel. At the same time, beryllium copper foil has high conductivity, thermal conductivity, high hardness and wear resistance, high creep resistance and corrosion resistance. It is widely used in the manufacturing of various mold inserts, replacing steel to produce high-precision and complex shaped molds, welding electrode materials for die-casting machines, injection molding machine punches, wear-resistant and corrosion-resistant work, etc. Beryllium copper foil is applied to micro electromechanical brushes, mobile phone batteries, computer connectors, various switch contacts, springs, clips, washers, membranes, membrane composites and other products. It is an indispensable and important industrial material in the construction of the national economy.
Brand number |
Main chemical composition content |
|||
ASTM |
Cu |
Ni |
Co |
Be |
C17200 |
margin |
① |
① |
1.80-2.10 |
“①”:Ni Co≥0.20%; Ni Fe Co≤0.60%;
Density: 8.6g/cm3
Hardness: 36-42HRC
Conductivity: ≥18%IACS
Tensile strength: ≥ 1100Mpa
Thermal conductivity: ≥ 105w/m.k20℃
Form: roll, strip
Thickness: 0.02-0.1mm
Width: 10-250mm
Thickness and width deviation: Follow the Chinese YS/T 323-2002 or American ASTMB 194-96 standards.
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