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The PI copper plated film is composed of a polyimide film (PI) and a copper thin film

Time:2023-03-06Number:2983
PI copper plated filmIt is a thin film material with high strength, high heat resistance, and high conductivity. It is a composite film composed of polyimide film (PI) and copper film, commonly used in the production of electronic products such as flexible circuit boards, LED light strips, and high-speed transmission cables. This article will introduce the preparation method, characteristics, and application fields of PI copper plating film.


镀铜膜

PI film preparation: PI film can be prepared using methods such as solution method, hot pressing method, and stretching method.
Among them, the solution method is the most commonly used method. Coat the PI solution on the substrate and form a PI film by drying and curing. PI film has high strength, high heat resistance, and high chemical stability, making it suitable for preparing PI copper plated films.
Copper coating: Coating a layer of copper film on the surface of PI film to form PI copper plated filmCopper plating can be achieved through electrochemical copper plating or chemical copper plating methods. Electrochemical copper plating is the process of depositing a layer of copper film on the surface of a PI film using an electrolytic cell. Chemical copper plating is the process of depositing a layer of copper film on the surface of a PI film through a chemical reaction. Copper film can improve the conductivity and mechanical strength of PI film.
Post treatment: After the preparation of PI copper plated film is completed, post-treatment is required to improve its performance and stability. Post processing can include heat treatment, chemical treatment, etc. Among them, heat treatment is to anneal the PI copper plated film at high temperature to improve its heat resistance and stability. Chemical treatment is the use of chemical reactions to surface treat PI copper plated films, in order to improve their chemical stability and corrosion resistance.
characteristic
PI copper plated film has characteristics such as high strength, high heat resistance, and high conductivity. Its high strength and high heat resistance make it suitable for making electronic products that require bending, such as flexible circuit boards and LED light strips. Its high conductivity makes it suitable for making electronic products that require high conductivity, such as high-speed transmission cables and antennas.
application area
PI copper plated film is widely used in the field of electronic products, especially in the field of flexible electronic products:
In the field of flexible circuit boards, PI copper plated film can be used as a metallization film. Its high strength and high heat resistance enable it to adapt to complex shapes such as bending and stretching, meeting the production requirements of flexible circuit boards. Meanwhile, its high conductivity can meet the conductivity requirements of circuit boards.
In the field of LED strips, PI copper plated film can be used as a conductive layer. Its high strength and high heat resistance enable it to adapt to the production of various shapes of light strips, while its high conductivity can meet the conductivity requirements of light strips.
In the field of high-speed transmission cables: PI copper plated filmCan be used as a conductive layer. Its high conductivity and stability can meet the requirements of high-speed transmission cables for conductivity and stability. In the field of antennas, PI copper plated film can be used as a conductive layer for antennas. Its high conductivity and stability can meet the antenna's requirements for conductivity and stability.

镀铜膜

summarize
PI copper plated film is a high-strength, heat-resistant, and highly conductive thin film material commonly used in the production of electronic products such as flexible circuit boards, LED light strips, and high-speed transmission cables. The preparation method includes three steps: PI film preparation, copper coating, and post-treatment. Among them, PI film is a high-strength, heat-resistant, and chemically stable polymer film composed of polyimide film. Copper plating can be achieved through electrochemical copper plating or chemical copper plating methods. Post processing can include heat treatment, chemical treatment, etc. PI copper plated film has characteristics such as high strength, high heat resistance, and high conductivity, and is widely used in the field of electronic products, especially in the field of flexible electronic products.

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