PE silver plated copper plated film is an important raw material in PCB, and chemical plating is generally used for it

In the production of electronic products, silver plating is often required on PCBs, such as silver contacts on mobile phone casings, circuit board surfaces in electronic products, and power and battery casings. So, how can we perform electroplating in a simple and reliable way?

1. The silver plating process is simple

2. Can obtain coatings with excellent characteristics

3. The coating and substrate have good adhesion

4. Uniform coating thickness

1. Can be used for various special materials such as PC/ABS, ABS/PC， Nylon, polyethylene, polyvinyl chloride and other materials.

2. The silver plating process is simple, cost-effective, and has good adhesion to the substrate.

4. Silver plating does not affect the conductivity of the substrate (i.e. does not affect its conductivity).

5. The product has good conductivity and corrosion resistance.

6. It can achieve excellent appearance.

7. Electroplated silver has a lower cost than electroplated copper.

8. The operating environment temperature should not exceed 60 ° C. Temperature range for use:- 10°C-40°C

The deposition reaction mechanism of silver: Silver is an inactive metal with extremely stable chemical properties, insoluble in general solvents and oxidants, and can form a dense film layer at room temperature. The silver coating has high bonding strength with the substrate. Copper is a reactive metal with active chemical properties. When in contact with various metals, it undergoes electrochemical reactions to form silver white intermetallic compound Cu (Ag) 3. When Cu (Ag) 3 combines with silver ions, compounds such as Cu (Ag) 3/Ag3PO4 or Ag2CO3/Ag2O are formed. Under appropriate conditions, silver ions can further combine with Cu (Ag) 3 to form more stable compounds, which are called silver plating compounds. Silver has stable chemical properties and can react with oxygen in the atmosphere to form AgO (O). However, when silver is oxidized, it will form AgO (O) again and lose its catalytic ability. Therefore, oxidation treatment is required before silver plating.

1. Acid washing for oil removal -2. Water washing -3. Activation (oxidation) -4. Oil removal -5. Silver washing -6. Water washing -7. Reduction (sensitization) -8. Activation (sensitization) -9. Silver plating (silver plating) -10. Drying -11. Water washing

12. Pre treatment -13, roughening chelation treatment -14, copper plating -15

1. Electroplating silver film should be operated in a clean and dry environment, avoiding contact with other pollutants.

2. For certain special processes, such as those that require operation in a closed environment, separate silver or copper plating solutions should be used.

3. For certain special processes, such as acid silver plating and copper plating, on-site temperature and time tests should be conducted. If necessary, adjustments can be made to the silver or copper plating solution.

1. The coating used for silver plating must meet the following conditions:

a) Uniform thickness;

b) Good adhesion;

c) Excellent conductivity.

2. In practical applications, silver plating is mainly used for the following purposes:

a) In situations where good conductivity is required, such as capacitors, semiconductor devices, various electrical equipment, and connectors for household appliances;

b) In situations where good corrosion resistance is required, such as connectors for various chemical equipment and precision instruments and meters;

c) Electronic product casing (such as mobile phones, laptops, digital cameras, etc.):

d) Conductive silver paste for printed circuit boards (such as mounting resistors, capacitors, or inductors on the surface of printed circuit boards to fix printed circuit boards and wiring, or to fix electronic components on printed circuit boards).

e) Other occasions that require conductivity.